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MAX3942ETG+T

Analog Devices

MAX3942ETG+T by Analog Devices

ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HQCCN; Package Shape: SQUARE;

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4

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1k+

MAX3942ETG+T by Analog Devices
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Digiode

USA . 1,701 parts In-Stock

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Vyrian

USA . 897 parts In-Stock

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Anansix

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Nova Conductors

Japan . 500 parts In-Stock

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AZTECH Wire

Italy . 384 parts In-Stock

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$7.968

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Corohmni

South Africa . 129 parts In-Stock

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MARBEL Systems

Belgium . 25 parts In-Stock

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Texas Native Microelectronics

USA . 301 parts In-Stock

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$16.408

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$15.526

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Kenton Components

USA . 5,826 parts In-Stock

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Qasali Group International

UK . 4,962 parts In-Stock

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Microchip USA

USA . 4,140 parts In-Stock

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One Stop Electronics

USA . 1,323 parts In-Stock

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Ampacity Inc.

Singapore . 403 parts In-Stock

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Semicontronic

India . 562 parts In-Stock

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Argo Parts USA

USA . 2,340 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 1,309 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Technical Specifications

ATM/SONET/SDH Circuits MAX3942ETG+T attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MAX3942ETG+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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