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LMK04102SQ

Texas Instruments

LMK04102SQ by Texas Instruments

LMK04102SQ by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating temperature range from -40 to 85°C, with a nominal voltage of 3.3V. Ideal for industrial telecom applications requiring very thin profile and no-lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,571 parts In-Stock

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4,571

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Vyrian

USA . 4,210 parts In-Stock

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4,210

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Anansix

USA . 213 parts In-Stock

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213

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Distributors (Availability)

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AZTECH Wire

Italy . 478 parts In-Stock

1+ parts

$7.169

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478

$7.169

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Parana Technologies

USA . 947 parts In-Stock

1+ parts

$13.419

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$13.934

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947

$13.419

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$13.934

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DigiPath Technology Company

USA . 162 parts In-Stock

1+ parts

$14.775

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162

$14.775

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ChromeModa Solutions

Germany . 4,690 parts In-Stock

1+ parts

$15.077

100+ parts

$12.363

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4,690

$15.077

$12.363

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IDEA Electronic Components Group

UK . 850 parts In-Stock

1+ parts

$15.077

100+ parts

$14.323

1k+ parts

$13.569

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850

$15.077

$14.323

$13.569

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One Stop Electronics

USA . 962 parts In-Stock

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$292.000

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962

$292.000

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Corphita

USA . 4,971 parts In-Stock

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4,971

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Overview

Enhance your network infrastructure with the LMK04102SQ by Texas Instruments, a top-of-the-line ATM/SONET/SDH circuit that guarantees unmatched quality and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product offers exceptional value and benefits to customers seeking optimal performance and precision in their telecom applications. Whether you're looking to improve signal processing or enhance data transmission, the LMK04102SQ delivers the advantages you need to stay ahead in today's competitive market. Trust Texas Instruments to provide cutting-edge solutions for all your networking needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient installation on circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

The square package shape makes this product compact and space-saving, ideal for crowded circuit board layouts.

No. of Terminals: 48

With a high number of terminals, this product can support complex circuit designs and connectivity requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability even under demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of environments, including harsh industrial settings.

Terminal Position: QUAD

The quad terminal position provides secure connections and stability, reducing the risk of signal loss or interference.

Maximum Seated Height: 0.8 mm

The low maximum seated height contributes to a slim and compact design, important for space-constrained applications.

Width: 7 mm

The narrow width of 7mm enables efficient use of space on a circuit board, allowing for high-density designs.

Length: 7 mm

The compact length of 7mm further contributes to the space-saving design of the product, making it suitable for small form factor applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can perform reliably in rugged industrial environments with varying temperature conditions.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

The specialized design for ATM/SONET/SDH support circuit makes this product specifically tailored for telecommunications applications requiring high-speed data transmission.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is commonly used in many electronic systems, providing compatibility and ease of integration.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and precise connections, essential for complex circuit configurations.

Technical Specifications

ATM/SONET/SDH Circuits LMK04102SQ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04102SQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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