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LMK04102SQ/NOPB

Texas Instruments

LMK04102SQ/NOPB by Texas Instruments

LMK04102SQ/NOPB by Texas Instruments is a 48-terminal chip carrier with matte tin finish. It operates in industrial temperature range (-40 to 85 °C) and supports SDH and SONET applications. With a nominal voltage of 3.3V, it features two channels for ATM/SONET/SDH circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,396 parts In-Stock

1+ parts

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7,396

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Digiode

USA . 1,478 parts In-Stock

1+ parts

-

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1,478

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Anansix

USA . 1,157 parts In-Stock

1+ parts

-

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1,157

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 851 parts In-Stock

1+ parts

$7.484

100+ parts

-

1k+ parts

$7.185

10k+ parts

$7.185

851

$7.484

-

$7.185

$7.185

Parana Technologies

USA . 2,132 parts In-Stock

1+ parts

$11.095

100+ parts

-

1k+ parts

$11.554

10k+ parts

-

2,132

$11.095

-

$11.554

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DigiPath Technology Company

USA . 2,080 parts In-Stock

1+ parts

$12.217

100+ parts

$11.239

1k+ parts

-

10k+ parts

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2,080

$12.217

$11.239

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ChromeModa Solutions

Germany . 5,019 parts In-Stock

1+ parts

$12.466

100+ parts

$10.222

1k+ parts

-

10k+ parts

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5,019

$12.466

$10.222

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IDEA Electronic Components Group

UK . 1,625 parts In-Stock

1+ parts

$12.466

100+ parts

$11.843

1k+ parts

$11.219

10k+ parts

-

1,625

$12.466

$11.843

$11.219

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AZTECH Wire

Italy . 811 parts In-Stock

1+ parts

$19.800

100+ parts

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811

$19.800

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Microchip USA

USA . 2,328 parts In-Stock

1+ parts

$24.300

100+ parts

$23.960

1k+ parts

$23.780

10k+ parts

$23.610

2,328

$24.300

$23.960

$23.780

$23.610

One Stop Electronics

USA . 1,092 parts In-Stock

1+ parts

$972.000

100+ parts

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1,092

$972.000

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Corphita

USA . 3,780 parts In-Stock

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3,780

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Overview

Unlock unparalleled performance and reliability with the LMK04102SQ/NOPB by Texas Instruments, a leading manufacturer in the industry. This cutting-edge ATM/SONET/SDH circuit offers superior quality and versatility for a wide range of applications including SDH and SONET. With its advanced features and innovative design, this product delivers exceptional value, benefits, and advantages to customers looking for top-notch telecom ICs. Trust Texas Instruments to provide you with the best-in-class solutions for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and helps in protecting the internal components of the circuit, making it a reliable choice for extended use.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this circuit can function effectively in various environmental conditions, ensuring consistent performance.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Designed specifically for ATM/SONET/SDH applications, this circuit provides optimized support and compatibility for telecommunications networks, making it a suitable choice for such systems.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures efficient power consumption and compatibility with standard power sources, making it a convenient option for integration into existing systems.

Technical Specifications

ATM/SONET/SDH Circuits LMK04102SQ/NOPB attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMK04102SQ/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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