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ADN2817ACPZ-RL

Analog Devices

ADN2817ACPZ-RL by Analog Devices

Analog Devices' ADN2817ACPZ-RL is a 32-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating at 3.3V, it has an industrial temperature grade and clock recovery capabilities for SDH and SONET applications. With a low supply current of 0.247mA, this IC is ideal for telecom systems requiring precise timing synchronization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,285 parts In-Stock

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7,285

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Digiode

USA . 24 parts In-Stock

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24

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Distributors (Availability)

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AZTECH Wire

Italy . 717 parts In-Stock

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$12.829

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717

$12.829

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Parana Technologies

USA . 810 parts In-Stock

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$14.584

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$13.563

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810

$14.584

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$13.563

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IDEA Electronic Components Group

UK . 1,078 parts In-Stock

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$15.682

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$14.898

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$14.898

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1,078

$15.682

$14.898

$14.898

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DigiPath Technology Company

USA . 363 parts In-Stock

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$24.464

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$23.485

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$23.485

363

$24.464

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$23.485

Native Components

USA . 575 parts In-Stock

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$92.150

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$88.464

575

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$88.464

Northwest PG Solutions

USA . 607 parts In-Stock

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$101.365

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607

$101.365

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One Stop Electronics

USA . 915 parts In-Stock

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$483.000

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$483.000

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Semicontronic

India . 1,349 parts In-Stock

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$713.000

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$695.175

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$691.610

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$713.000

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Corphita

USA . 779 parts In-Stock

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Overview

Elevate your networking experience with the ADN2817ACPZ-RL by Analog Devices, a top-tier manufacturer in the industry. Designed for ATM/SONET/SDH circuits, this product offers unmatched quality and reliability. Ideal for SDH and SONET applications, this versatile chip carrier with a very thin profile maximizes performance while minimizing space requirements. With a nominal supply voltage of 3.3V and low supply current, the ADN2817ACPZ-RL delivers exceptional value and efficiency to customers seeking cutting-edge telecom IC solutions. Upgrade your network today with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on surface mount PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape offers a stable and compact form factor, making it ideal for high-density applications.

Power Supplies (V): 3.3

Compatible with standard 3.3V power supplies, ensuring widespread compatibility in different systems.

No. of Terminals: 32

Sufficient number of terminals for connecting various components and interfaces within the circuit.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

Can function reliably in extremely low temperatures, ensuring performance in a wide range of operating conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and ensures good electrical conductivity for reliable signal transmission.

Maximum Seated Height: 1 mm

Low profile design saves space and allows for compact integration in tight spaces or stacked PCB assemblies.

Width: 5 mm

Compact width dimension facilitates efficient PCB layout and minimizes space requirements for the overall system.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions commonly found in industrial settings.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, ensuring compatibility and optimal performance in telecom networks.

Maximum Supply Current: 0.247 mA

Low supply current consumption for energy-efficient operation and reduced power consumption in the system.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

Specialized IC type for clock recovery in ATM, SONET, and SDH systems, offering precise timing and synchronization functions.

Technical Specifications

ATM/SONET/SDH Circuits ADN2817ACPZ-RL attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.247 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

ADN2817ACPZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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