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STLVD112BTR

STMicroelectronics

STLVD112BTR by STMicroelectronics

STLVD112BTR by STMicroelectronics is a CMOS telecom IC designed for ATM/SONET/SDH applications. It operates at 3.3V with a temperature range of -40 °C to 85 °C and features a compact 48-terminal, thin-profile package. Ideal for industrial use, it supports reliable data transmission in telecommunications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,930 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,930

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Digiode

USA . 2,829 parts In-Stock

1+ parts

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1k+ parts

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2,829

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Anansix

USA . 1,219 parts In-Stock

1+ parts

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1,219

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 566 parts In-Stock

1+ parts

$6.640

100+ parts

-

1k+ parts

$5.976

10k+ parts

-

566

$6.640

-

$5.976

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MKK Technologies

India . 1,055 parts In-Stock

1+ parts

$12.485

100+ parts

-

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10k+ parts

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1,055

$12.485

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DigiPath Technology Company

USA . 1,055 parts In-Stock

1+ parts

$12.485

100+ parts

-

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10k+ parts

-

1,055

$12.485

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Parana Technologies

USA . 1,082 parts In-Stock

1+ parts

-

100+ parts

$7.939

1k+ parts

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10k+ parts

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1,082

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$7.939

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Corphita

USA . 895 parts In-Stock

1+ parts

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100+ parts

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895

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Overview

Elevate your telecom solutions with the STLVD112BTR from STMicroelectronics, a trusted name in innovation. This high-performance ATM/SONET/SDH circuit combines reliability and efficiency, designed for demanding industrial applications in varying environments. With its compact design and robust temperature tolerance, it seamlessly integrates into your systems, delivering unparalleled performance and longevity. Choose STLVD112BTR for superior quality that empowers your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robust protection against environmental factors, enhancing the reliability and longevity of the product.

Surface Mount: YES

Surface mount technology allows for efficient use of space on circuit boards, facilitating high-density designs and improving overall performance in compact applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout flexibility for circuit design, making integration easier in various configurations.

Power Supplies (V): 3.3

Operating at a common voltage of 3.3 V ensures compatibility with a wide range of devices, streamlining integration into existing systems.

No. of Terminals: 48

A high terminal count supports complex functionalities and connections, catering to advanced telecom applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design make it suitable for space-constrained environments, ideal for modern telecom designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product ensures reliable performance in demanding environments without overheating.

Minimum Operating Temperature: -40 °C

The ability to function at extremely low temperatures enhances reliability in harsh conditions, making it suitable for a wide range of industrial applications.

Terminal Position: DUAL

Dual terminal positioning contributes to better electrical performance and facilitates effective heat dissipation.

Maximum Seated Height: 1.2 mm

Low seated height is advantageous for low-profile designs, allowing for more compact assemblies without compromising performance.

Width: 6.1 mm

A width of 6.1 mm strikes a balance between compactness and functionality, suitable for a variety of applications.

Length: 12.5 mm

A moderate length allows easy integration into various circuit layouts while still providing sufficient functionality.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness against fluctuating environmental conditions, providing reliability in challenging settings.

Applications: SDH; SONET

Specialized for SDH and SONET applications, making it an optimal choice for high-speed telecommunications and network infrastructure.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, enhancing efficiency in circuit design.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical stability, ensuring reliable connections.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Designed specifically as a support circuit for ATM/SONET/SDH, this product ensures optimal performance for these advanced telecom standards.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is widely used in digital circuits, promoting compatibility with other common components and systems.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density layouts, supporting intricate circuit designs while ensuring ease of soldering.

Technical Specifications

ATM/SONET/SDH Circuits STLVD112BTR attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from STMicroelectronics

Specs

Applications:

SDH; SONET

JESD-30 Code:

R-PDSO-G48

Length:

12.5 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Trade Compliance

STLVD112BTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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