Loading...

STLVD112CTR

STMicroelectronics

STLVD112CTR by STMicroelectronics

STLVD112CTR by STMicroelectronics is a CMOS telecom IC designed for ATM/SONET/SDH applications. It features a 3.3V nominal supply, operates in temperatures from 0 °C to 70 °C, and comes in a compact 48-terminal package. Ideal for enhancing network performance in telecommunications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,505

-

-

-

-

Digiode

USA . 2,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,337

-

-

-

-

Anansix

USA . 542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

542

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 709 parts In-Stock

1+ parts

$8.335

100+ parts

-

1k+ parts

$7.502

10k+ parts

-

709

$8.335

-

$7.502

-

MKK Technologies

India . 1,996 parts In-Stock

1+ parts

$15.674

100+ parts

-

1k+ parts

-

10k+ parts

-

1,996

$15.674

-

-

-

DigiPath Technology Company

USA . 1,996 parts In-Stock

1+ parts

$15.674

100+ parts

-

1k+ parts

-

10k+ parts

-

1,996

$15.674

-

-

-

Corphita

USA . 2,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,829

-

-

-

-

Parana Technologies

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$9.966

1k+ parts

-

10k+ parts

-

50

-

$9.966

-

-

Overview

Unlock unparalleled performance and reliability with the STLVD112CTR from STMicroelectronics, a leader in innovative circuit solutions. Engineered for ATM, SONET, and SDH applications, this high-quality component ensures seamless data transmission in telecommunications. Its compact design fits effortlessly within your projects, providing exceptional durability and efficiency. Choose STLVD112CTR for superior connectivity that empowers your designs and boosts productivity—experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures a robust build, enhancing the longevity and reliability of the product in various operating environments.

Surface Mount: YES

Surface mounting enables efficient use of PCB space, allowing for more compact designs and improved performance in high-density applications.

Package Shape: RECTANGULAR

A rectangular package shape facilitates easier PCB integration and alignment, making it suitable for automated assembly processes.

Power Supplies (V): 3.3

Operating at 3.3 V power supply is ideal for modern low-power applications, contributing to energy efficiency in telecom designs.

No. of Terminals: 48

With 48 terminals, this product offers ample connectivity options, accommodating complex circuit designs and allowing for versatile deployment.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for compact applications, ensuring efficient use of space without sacrificing functionality.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in diverse environments, making it suitable for various telecom applications.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C ensures reliable performance in cooler conditions, enhancing the product's versatility across different environments.

Terminal Position: DUAL

Dual terminal positioning can provide better electrical connectivity and improve overall signal integrity in circuit designs.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm supports compact designs and minimizes the impact on PCB stack height, which is essential in space-constrained applications.

Width: 6.1 mm

The 6.1 mm width contributes to efficient use of board space, facilitating high-density PCB designs without compromising performance.

Length: 12.5 mm

At 12.5 mm long, it strikes a balance between size and functionality, making it easy to integrate into various circuit layouts.

Temperature Grade: COMMERCIAL

Rated for commercial temperature conditions, this product is suitable for a wide range of applications, ensuring dependable operation.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, it addresses critical requirements in the telecommunications industry, making it a specialized choice.

Technology: CMOS

Utilizing CMOS technology lends low power consumption and high-speed performance, crucial for modern telecom circuits.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical stability, enhancing reliability in surface mount applications.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Being specifically designed for ATM/SONET/SDH support ensures that this product meets essential communication standards for the telecom industry.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is conducive to achieving energy-efficient designs, accommodating a broad range of application needs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density designs while maintaining signal integrity, making it ideal for advanced telecom applications.

Technical Specifications

ATM/SONET/SDH Circuits STLVD112CTR attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from STMicroelectronics

Specs

Applications:

SDH; SONET

JESD-30 Code:

R-PDSO-G48

Length:

12.5 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

STLVD112CTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 1