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SLK2504IGPV

Texas Instruments

SLK2504IGPV by Texas Instruments

SLK2504IGPV by Texas Instruments is an industrial-grade ATM/SONET/SDH transceiver with CMOS technology. It operates b/w -40°C to 85°C, featuring a grid array package style with 289 terminals. Ideal for SDH and SONET applications, it has a nominal voltage of 1.8V and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,604 parts In-Stock

1+ parts

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8,604

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Digiode

USA . 3,553 parts In-Stock

1+ parts

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3,553

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,137 parts In-Stock

1+ parts

$10.942

100+ parts

-

1k+ parts

$11.409

10k+ parts

-

2,137

$10.942

-

$11.409

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DigiPath Technology Company

USA . 1,845 parts In-Stock

1+ parts

$12.048

100+ parts

-

1k+ parts

-

10k+ parts

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1,845

$12.048

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ChromeModa Solutions

Germany . 5,564 parts In-Stock

1+ parts

$12.294

100+ parts

$10.081

1k+ parts

-

10k+ parts

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5,564

$12.294

$10.081

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IDEA Electronic Components Group

UK . 2,110 parts In-Stock

1+ parts

$12.294

100+ parts

$11.679

1k+ parts

$11.065

10k+ parts

-

2,110

$12.294

$11.679

$11.065

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AZTECH Wire

Italy . 895 parts In-Stock

1+ parts

$17.235

100+ parts

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895

$17.235

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One Stop Electronics

USA . 1,219 parts In-Stock

1+ parts

$701.000

100+ parts

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1,219

$701.000

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Corphita

USA . 3,391 parts In-Stock

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3,391

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Overview

Upgrade your network with the SLK2504IGPV by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality ATM/SONET/SDH Circuits that are guaranteed to enhance your telecommunications systems. This cutting-edge product boasts a wide range of applications, including SDH and SONET, making it a versatile solution for your networking needs. With its durable plastic/epoxy body and industrial-grade temperature range, this transceiver offers unmatched reliability and performance. Trust Texas Instruments to provide you with the innovation and value you need to stay ahead in the fast-paced world of telecommunications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides good mechanical protection to the internal components and ensures durability of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on PCBs, saving space and reducing overall product size.

No. of Terminals: 289

High number of terminals allows for greater connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh or high temperature environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can operate efficiently in cold temperatures as well.

Technology: CMOS

CMOS technology provides lower power consumption and higher noise immunity, making the product energy efficient and reliable.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage allows for efficient power usage and compatibility with a wide range of systems.

Technical Specifications

ATM/SONET/SDH Circuits SLK2504IGPV attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PBGA-B289

No. of Functions:

1

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

SLK2504IGPV Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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