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ADN2805ACPZ-RL7

Analog Devices

ADN2805ACPZ-RL7 by Analog Devices

ADN2805ACPZ-RL7 by Analog Devices is a 32-terminal ATM/SONET/SDH clock recovery circuit with a 3.3V supply voltage and industrial temperature grade. It features a square surface mount package, matte tin terminal finish, and operates b/w -40 to 85 °C. Ideal for SONET applications due to its compact size and low supply current of 0.131 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,982 parts In-Stock

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ComSIT Distribution GmbH

Germany . 325 parts In-Stock

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325

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Digiode

USA . 317 parts In-Stock

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317

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Native Components

USA . 445 parts In-Stock

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$1.665

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445

$1.665

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Northwest PG Solutions

USA . 2,005 parts In-Stock

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$1.831

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$1.831

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AZTECH Wire

Italy . 609 parts In-Stock

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$10.735

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Parana Technologies

USA . 2,239 parts In-Stock

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$12.203

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$11.349

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IDEA Electronic Components Group

UK . 1,709 parts In-Stock

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$13.122

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$12.466

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$12.466

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DigiPath Technology Company

USA . 808 parts In-Stock

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$20.470

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$19.652

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$19.652

808

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$19.652

Semicontronic

India . 1,044 parts In-Stock

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$37.000

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$36.075

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$35.890

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One Stop Electronics

USA . 458 parts In-Stock

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$365.000

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QUARKTWIN TECHNOLOGY LTD

USA . 21,617 parts In-Stock

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Kepictronics

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Vigor

Singapore . 4,282 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unlock the power of high-quality telecom solutions with the ADN2805ACPZ-RL7 by Analog Devices. Designed for ATM/SONET/SDH circuits, this surface mount chip carrier offers exceptional reliability and performance in industrial applications. With a nominal supply voltage of 3.3V and low supply current, this device delivers value and efficiency to customers looking for top-notch clock recovery circuits. Trust Analog Devices for cutting-edge technology that meets the demands of the modern telecom industry.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easier to assemble and mount this product onto circuit boards, saving time and effort in manufacturing processes.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the circuit board, allowing for compact designs and better utilization of available area.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes this product compatible with a wide range of systems and devices, ensuring seamless integration.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for diverse input and output configurations, increasing the versatility of this product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers efficient heat dissipation and space-saving properties, enhancing overall performance and design flexibility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding environmental conditions without compromising its functionality or longevity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in extreme cold environments, making this product suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring secure and durable connections for enhanced reliability.

Terminal Position: QUAD

The quad terminal position facilitates easy and stable mounting on the circuit board, optimizing the electrical connections and overall performance of the product.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, this product offers a low profile design that helps conserve space and facilitates compact and sleek system configurations.

Width: 5 mm

The 5mm width of this product allows for efficient use of board space, enabling compact and streamlined designs for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand up to 30 seconds at peak reflow temperature of 260 °C ensures proper soldering and assembly of this product, contributing to its durability and reliability.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the rigorous temperature and performance requirements of industrial environments, ensuring reliable operation in challenging conditions.

Applications: SONET

Specifically designed for SONET applications, this product offers optimized performance and compatibility for SONET networks, making it a reliable choice for such communication systems.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and complies with environmental regulations, making this product a sustainable and eco-friendly choice.

Maximum Supply Current: 0.131 mA

With a maximum supply current of 0.131 mA, this product operates efficiently and consumes minimal power, contributing to energy savings and overall system performance.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

As a specialized telecom IC for clock recovery in ATM/SONET/SDH systems, this product ensures precise and reliable timing synchronization critical for high-speed communication networks.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, this product offers consistent and stable power delivery for reliable performance in various telecom applications.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides for precise and secure connections on the circuit board, enhancing the electrical performance and signal integrity of the product.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is less susceptible to moisture-related damage during handling and storage, ensuring product reliability and longevity.

Technical Specifications

ATM/SONET/SDH Circuits ADN2805ACPZ-RL7 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SONET

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.131 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

ADN2805ACPZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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