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LMK04131SQX

Texas Instruments

LMK04131SQX by Texas Instruments

LMK04131SQX by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating at -40 to 85°C, it supports a nominal voltage of 3.3V for industrial telecom applications. With a terminal pitch of 0.5mm and no-lead terminal form, it offers compact design and high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,564 parts In-Stock

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4,564

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Digiode

USA . 3,129 parts In-Stock

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3,129

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Anansix

USA . 942 parts In-Stock

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942

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 643 parts In-Stock

1+ parts

$11.184

100+ parts

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1k+ parts

$11.628

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643

$11.184

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$11.628

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DigiPath Technology Company

USA . 28 parts In-Stock

1+ parts

$12.315

100+ parts

$11.330

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28

$12.315

$11.330

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ChromeModa Solutions

Germany . 3,490 parts In-Stock

1+ parts

$12.566

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$10.304

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3,490

$12.566

$10.304

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IDEA Electronic Components Group

UK . 1,586 parts In-Stock

1+ parts

$12.566

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$11.938

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$11.309

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1,586

$12.566

$11.938

$11.309

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AZTECH Wire

Italy . 886 parts In-Stock

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$15.483

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886

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One Stop Electronics

USA . 527 parts In-Stock

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$552.000

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527

$552.000

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Alle Elektronik GmbH

Germany . 4,255 parts In-Stock

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Corphita

USA . 3,594 parts In-Stock

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Kepictronics

USA . 2,380 parts In-Stock

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2,380

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Overview

Maximize your network performance with the LMK04131SQX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality ATM/SONET/SDH Circuits designed for seamless integration and optimal functionality. This surface-mount, square-shaped package offers 48 terminals and a very thin profile, making it ideal for a wide range of applications. With an industrial temperature grade and a nominal supply voltage of 3.3V, this telecom IC type circuit ensures reliable operation in any environment. Trust Texas Instruments to provide the value, benefits, and advantages you need to elevate your network capabilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost during production.

Package Shape: SQUARE

The square shape of the package provides a compact design, making it easier to integrate into tight spaces within electronic devices.

No. of Terminals: 48

With a high number of terminals, this product offers versatility in connecting to other components within a circuit, allowing for complex functionalities.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and a very thin profile design ensures efficient heat dissipation and space-saving attributes in the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance provides durability and reliability in various environmental conditions, ensuring consistent performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the product to function effectively in extreme cold climates, increasing its versatility.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connection points, reducing the risk of disconnection or signal interruptions.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm ensures a low-profile design, making it suitable for applications where space is limited.

Width: 7 mm

The narrow width of 7 mm contributes to the compact size of the product, enabling easy integration into electronic systems with space constraints.

Length: 7 mm

The short length of 7 mm further enhances the compactness of the product, making it ideal for use in small electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh operating conditions typically found in industrial environments, enhancing its durability.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and provides a reliable connection, reducing the risk of lead contamination and improving long-term performance.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

The support for ATM/SONET/SDH circuits makes this product suitable for telecommunications applications, offering advanced functionality and compatibility with industry standards.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage is commonly used in electronics, ensuring compatibility with existing systems and facilitating easy integration into various circuits.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for precise and convenient connections, enabling efficient signal transmission and reducing the risk of signal interference.

Technical Specifications

ATM/SONET/SDH Circuits LMK04131SQX attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04131SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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