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LMK04101SQE

Texas Instruments

LMK04101SQE by Texas Instruments

LMK04101SQE by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. It operates b/w -40°C to 85°C, with a nominal voltage of 3.3V. Ideal for industrial telecom applications requiring very thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,840 parts In-Stock

1+ parts

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3,840

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Digiode

USA . 3,100 parts In-Stock

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3,100

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Anansix

USA . 349 parts In-Stock

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349

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 584 parts In-Stock

1+ parts

$9.758

100+ parts

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584

$9.758

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Parana Technologies

USA . 1,891 parts In-Stock

1+ parts

$12.072

100+ parts

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1k+ parts

$12.483

10k+ parts

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1,891

$12.072

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$12.483

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DigiPath Technology Company

USA . 293 parts In-Stock

1+ parts

$13.293

100+ parts

$12.229

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293

$13.293

$12.229

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ChromeModa Solutions

Germany . 2,156 parts In-Stock

1+ parts

$13.564

100+ parts

$11.122

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2,156

$13.564

$11.122

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IDEA Electronic Components Group

UK . 1,183 parts In-Stock

1+ parts

$13.564

100+ parts

$12.886

1k+ parts

$12.208

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1,183

$13.564

$12.886

$12.208

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One Stop Electronics

USA . 1,510 parts In-Stock

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$271.000

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1,510

$271.000

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Corphita

USA . 3,699 parts In-Stock

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3,699

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Overview

Elevate your telecom systems with the LMK04101SQE by Texas Instruments. Designed for ATM/SONET/SDH circuits, this surface mount chip carrier offers unparalleled quality and reliability. With a terminal pitch of 0.5mm and an industrial temperature grade, this IC ensures optimal performance in any environment. Experience seamless integration and precise functionality with 48 terminals and a compact square package shape. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Upgrade your telecom solutions with the LMK04101SQE and unlock a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure installation on circuit boards, making it suitable for mass production and assembly.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board, maximizing component density.

No. of Terminals: 48

Provides sufficient connectivity for complex ATM/SONET/SDH circuits, enabling multiple functions to be supported.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and thin profile design enhances thermal performance and reduces overall size, ideal for tight spaces and heat dissipation requirements.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures, ensuring reliability and stability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold temperatures, making it suitable for a wide range of operating conditions.

Terminal Position: QUAD

Quad terminal positioning increases connectivity options and allows for more efficient signal routing.

Maximum Seated Height: 0.8 mm

Low seated height minimizes component profile, contributing to compact designs and efficient PCB layouts.

Width: 7 mm

Compact width allows for space-saving integration within circuit board layouts.

Length: 7 mm

Short length helps in saving board space and accommodating other components within the layout.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature grade standards, ensuring reliable operation in harsh environmental conditions.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations, making the product eco-friendly and safe for use.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed to support ATM, SONET, and SDH circuits, enhancing performance and efficiency in telecom applications.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage level, facilitating compatibility with existing circuit configurations and power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise connections and signal transmission, critical for high-speed data processing in ATM/SONET/SDH circuits.

Technical Specifications

ATM/SONET/SDH Circuits LMK04101SQE attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04101SQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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