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MC10SX1401FJR2

Onsemi

MC10SX1401FJR2 by Onsemi

MC10SX1401FJR2 by Onsemi is an ECL10K technology chip carrier with 52 terminals, operating b/w -40 to 85 °C. It has a 5V supply and is used in ATM/SONET/SDH circuits for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,279 parts In-Stock

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Digiode

USA . 947 parts In-Stock

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947

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Problanco Electronics

Mexico . 5,585 parts In-Stock

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5,585

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SupplyDigital Components

Austria . 5,255 parts In-Stock

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TANS Electronics

Latvia . 3,387 parts In-Stock

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Corphita

USA . 843 parts In-Stock

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843

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UHIMA Technologies

Türkiye . 836 parts In-Stock

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836

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Kulean Microsystems

USA . 558 parts In-Stock

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Corohmni

South Africa . 283 parts In-Stock

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Overview

Upgrade your network performance with the MC10SX1401FJR2 by Onsemi. Manufactured with top-quality materials and cutting-edge technology, this ATM/SONET/SDH circuit offers unmatched reliability and efficiency for your communication systems. With a wide operating temperature range and high terminal count, this chip carrier is perfect for industrial applications. Trust Onsemi to deliver superior products that provide value and benefits to customers. Boost your network capabilities today with the MC10SX1401FJR2.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and stability, ensuring reliable performance even in high temperature environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and reducing the overall footprint of the circuit.

Package Shape: SQUARE

Square package shape facilitates easy placement and alignment on the PCB, improving overall manufacturing efficiency.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes the product compatible with a wide range of existing systems and power supplies.

No. of Terminals: 52

Having a higher number of terminals allows for increased connectivity options and flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and lightweight, making it suitable for applications where space-saving is a priority.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand extreme heat conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40 °C ensures reliability even in harsh environmental conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and durability, ensuring secure connections and long-term reliability.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connection, simplifying the manufacturing process and improving overall product quality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in rugged industrial environments where temperature fluctuations are common.

Technology: ECL10K

ECL10K technology offers high-speed operation and low power consumption, making the product suitable for high-performance applications.

Terminal Form: J BEND

J bend terminal form provides secure anchoring and reliable electrical connections, ensuring long-lasting performance under varying conditions.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and existing circuit designs.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27mm allows for high-density mounting and efficient use of PCB real estate, enabling compact and space-saving designs.

Technical Specifications

ATM/SONET/SDH Circuits MC10SX1401FJR2 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-J52

JESD-609 Code:

e0

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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