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DS3161N+

Analog Devices

DS3161N+ by Analog Devices

Analog Devices' DS3161N+ is an ATM/SONET/SDH circuit with 3.3V supply, 400 terminals, and operates b/w -40 to 85 °C. It's a telecom IC for ATM, SDH, SONET networks in industrial settings. The package is square-shaped, surface-mountable with TIN SILVER COPPER finish and BALL terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,507 parts In-Stock

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Anansix

USA . 660 parts In-Stock

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Digiode

USA . 583 parts In-Stock

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MARBEL Systems

Belgium . 1,000 parts In-Stock

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$9.156

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AZTECH Wire

Italy . 301 parts In-Stock

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$10.420

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Texas Native Microelectronics

USA . 300 parts In-Stock

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$10.524

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$10.103

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$9.787

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$9.261

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$10.524

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$9.261

Kenton Components

USA . 1,764 parts In-Stock

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$12.629

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$11.113

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Qasali Group International

UK . 2,765 parts In-Stock

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$28.415

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$26.426

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$25.005

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Native Components

USA . 1,605 parts In-Stock

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$134.180

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$128.813

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Northwest PG Solutions

USA . 2,212 parts In-Stock

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$147.598

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Semicontronic

India . 683 parts In-Stock

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$389.000

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$379.275

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$377.330

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One Stop Electronics

USA . 1,456 parts In-Stock

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Corphita

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Overview

Elevate your networking capabilities with the DS3161N+ from Analog Devices, a leading manufacturer in the industry. Designed for ATM/SONET/SDH circuits, this high-quality product offers unparalleled performance and reliability. Whether you're looking to enhance your ATM, SDH, or SONET applications, this versatile solution provides the value, benefits, and advantages that customers need. Trust Analog Devices to deliver cutting-edge technology that meets your networking needs. Upgrade to the DS3161N+ and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy installation onto circuit boards, saving time and effort in the manufacturing process.

Package Shape: SQUARE

Square shape helps in efficient placement on the circuit board, optimizing space utilization in the overall design.

Power Supplies (V): 3.3

Operating at 3.3V provides a standard power supply level, ensuring compatibility with a wide range of systems and devices.

No. of Terminals: 400

Having 400 terminals allows for connectivity to multiple components, enhancing the functionality and versatility of the product.

Package Style (Meter): GRID ARRAY

Grid array package style offers a compact and organized layout, facilitating easier integration into complex circuit designs.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C ensures reliable performance even in high-temperature environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the product can withstand cold conditions without compromising functionality.

Terminal Finish: TIN SILVER COPPER

Terminal finish with Tin, Silver, and Copper ensures good conductivity and corrosion resistance, maintaining signal integrity over time.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and soldering, simplifying the assembly process.

Maximum Seated Height: 2.54 mm

Low seated height of 2.54mm minimizes the overall profile of the product, ideal for compact designs and space-constrained applications.

Width: 27 mm

Having a width of 27mm offers a balance between size and functionality, making it suitable for various circuit board configurations.

Length: 27 mm

With a length of 27mm, the product provides a square form factor for efficient placement and alignment on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments, making it suitable for industrial applications.

Applications: ATM; SDH; SONET

Compatible with ATM, SDH, and SONET applications, providing versatility and flexibility for different networking needs.

Nominal Supply Voltage: 3.3 V

Operating at 3.3V nominal supply voltage offers standard power compatibility and ensures stable performance across various systems.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm allows for precise and reliable connections, enhancing signal integrity and overall performance.

Technical Specifications

ATM/SONET/SDH Circuits DS3161N+ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

ATM; SDH; SONET

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

27 mm

No. of Functions:

1

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA400,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.218 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

DS3161N+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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