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MC10SX1125DR2

Onsemi

MC10SX1125DR2 by Onsemi

MC10SX1125DR2 by Onsemi is a 16-terminal ATM/SONET/SDH circuit in a small outline package. Operating at 5V, it supports ECL10K technology with dual terminals and Gull Wing form. Ideal for industrial applications like ATM, SDH, and SONET due to its compact size and low supply current of 0.045 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,047 parts In-Stock

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Digiode

USA . 1,214 parts In-Stock

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Semi Source

USA . 1,106 parts In-Stock

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Problanco Electronics

Mexico . 6,708 parts In-Stock

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TANS Electronics

Latvia . 2,832 parts In-Stock

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Kulean Microsystems

USA . 2,517 parts In-Stock

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Corphita

USA . 2,153 parts In-Stock

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SupplyDigital Components

Austria . 1,388 parts In-Stock

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UHIMA Technologies

Türkiye . 656 parts In-Stock

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Corohmni

South Africa . 174 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the MC10SX1125DR2 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers cutting-edge technology with a focus on performance and innovation. This ATM/SONET/SDH circuit is ideal for a range of applications, offering customers seamless connectivity and superior functionality. With a compact design and industrial-grade temperature rating, this product provides unmatched value and benefits for all your telecom needs. Elevate your projects with the MC10SX1125DR2 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is highly durable and resistant to moisture, making this product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the product onto circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular package shape allows for compact and efficient stacking of multiple components on a circuit board, saving valuable space.

Power Supplies (V): 5

Operating at 5V ensures compatibility with standard power supplies and reduces the need for additional voltage regulation components.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for integrating the product into various circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes the footprint of the product on the circuit board, allowing for greater flexibility in layout design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can reliably function in demanding environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

Operational down to -40 °C ensures reliable performance even in cold temperature environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures a secure connection between the product and the circuit board.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in orientation during installation, ensuring compatibility with various circuit layouts.

Maximum Seated Height: 1.75 mm

Low maximum seated height enables a slim profile for the product, reducing the overall size of the assembled circuit board.

Width: 3.9 mm

Compact width dimension allows for efficient use of space on the circuit board, especially when multiple components need to be placed in close proximity.

Length: 9.9 mm

Optimal length dimension strikes a balance between space-saving design and providing sufficient room for the necessary circuit connections.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating environments typically encountered in industrial applications.

Applications: ATM; SDH; SONET

Supports a wide range of applications including ATM, SDH, and SONET, making it a versatile choice for various networking and telecommunications systems.

Technology: ECL10K

Utilizing ECL10K technology ensures high-speed and reliable performance, ideal for demanding networking applications like ATM, SDH, and SONET.

Terminal Form: GULL WING

Gull wing terminal form provides robust mechanical support and allows for easy inspection and rework during assembly.

Maximum Supply Current: 0.045 mA

Low maximum supply current consumption helps in reducing power consumption and heat generation, making the product energy-efficient.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed for ATM, SONET, and SDH support circuits, ensuring optimal performance and compatibility with telecommunication systems.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V provides compatibility with standard power requirements in telecommunications and networking equipment.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for high-density mounting of components on the circuit board, optimizing space usage and enabling compact designs.

Technical Specifications

ATM/SONET/SDH Circuits MC10SX1125DR2 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Onsemi

Specs

Applications:

ATM; SDH; SONET

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.045 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC10SX1125DR2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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