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MC10SX1125ADR2

Onsemi

MC10SX1125ADR2 by Onsemi

MC10SX1125ADR2 by Onsemi is an ATM/SONET/SDH circuit with 16 terminals, operating b/w -40 to 85 °C. It supports a nominal voltage of 5V and has a small outline package style for industrial telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,120 parts In-Stock

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Vyrian

USA . 306 parts In-Stock

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306

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SupplyDigital Components

Austria . 6,980 parts In-Stock

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6,980

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Corphita

USA . 2,367 parts In-Stock

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Kulean Microsystems

USA . 1,487 parts In-Stock

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Problanco Electronics

Mexico . 986 parts In-Stock

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TANS Electronics

Latvia . 969 parts In-Stock

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UHIMA Technologies

Türkiye . 878 parts In-Stock

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Corohmni

South Africa . 85 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the MC10SX1125ADR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge solutions for ATM/SONET/SDH circuits. This small outline package offers a multitude of applications, from telecom to industrial settings. With a wide operating temperature range and gull wing terminal form, this product ensures optimal performance in any environment. Trust Onsemi's expertise and elevate your projects with the MC10SX1125ADR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal stability and can withstand various environmental conditions, making the product durable and reliable.

Surface Mount: YES

Surface mount technology makes the product easy to install and saves space on a circuit board, enhancing overall system integration.

Package Shape: RECTANGULAR

Rectangular shape makes the product compact and allows for efficient placement on a circuit board, optimizing space utilization.

No. of Terminals: 16

With 16 terminals, the product can support multiple connections, enabling versatile networking options.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can function reliably even in demanding operating conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to operate in cold environments without compromising performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in connecting the product to other components, enhancing compatibility and versatility.

Width: 3.9 mm

Narrow width allows for efficient use of space on a circuit board, enabling compact and streamlined system design.

Length: 9.9 mm

Optimal length provides a balance between compact size and functionality, ensuring the product fits well within existing system layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates the product is designed for rugged environments and can withstand harsh industrial settings.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage is common in many electronic systems, ensuring compatibility and ease of integration with existing setups.

Terminal Pitch: 1.27 mm

Small terminal pitch allows for precise connections and high-density mounting, facilitating efficient signal transmission and circuit layout.

Technical Specifications

ATM/SONET/SDH Circuits MC10SX1125ADR2 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC10SX1125ADR2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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