Loading...

MC10SX1125AD

Onsemi

MC10SX1125AD by Onsemi

MC10SX1125AD by Onsemi is an ATM/SONET/SDH circuit in a small outline package. It operates b/w -40 to 85 °C, with 16 terminals and a nominal voltage of 5V. Ideal for industrial telecom applications due to its compact size and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,386

-

-

-

-

Vyrian

USA . 2,286 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 8,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,224

-

-

-

-

TANS Electronics

Latvia . 6,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,216

-

-

-

-

Problanco Electronics

Mexico . 5,452 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,452

-

-

-

-

SupplyDigital Components

Austria . 4,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,223

-

-

-

-

Corphita

USA . 993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

993

-

-

-

-

Corohmni

South Africa . 204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

204

-

-

-

-

UHIMA Technologies

Türkiye . 29 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29

-

-

-

-

Overview

Elevate your networking capabilities with the MC10SX1125AD by Onsemi. Known for their superior quality and innovative technology, Onsemi delivers exceptional products in the ATM/SONET/SDH Circuits category. This versatile telecom IC offers unmatched performance and reliability, making it ideal for a wide range of applications. Whether you're looking to enhance your network infrastructure or streamline your communication systems, the MC10SX1125AD provides value, benefits, and advantages that will elevate your experience. Experience the difference with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides a lightweight and durable casing for the product.

Surface Mount: YES

Being surface mountable allows for easier and more convenient integration into circuit boards.

Package Shape: RECTANGULAR

The rectangular shape contributes to efficient use of space on a circuit board.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of environments.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit connections and configurations.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a compact overall design.

Width: 3.9 mm

The narrow width facilitates fitting the product in tight spaces on a circuit board.

Length: 9.9 mm

The moderate length offers a balance between space efficiency and functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and consistent performance in various working environments.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure connections.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

This product is specifically designed to support ATM/SONET/SDH circuits, ensuring compatibility and optimized performance.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common standard in many electronic systems, making integration easier.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for dense packing of terminals on a circuit board, enabling more functionality in a limited space.

Technical Specifications

ATM/SONET/SDH Circuits MC10SX1125AD attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC10SX1125AD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17