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MC10SX1405FJR2

Onsemi

MC10SX1405FJR2 by Onsemi

MC10SX1405FJR2 by Onsemi is an ATM/SONET/SDH converter with 52 terminals, operating at 5V. It features ECL10K technology, J BEND terminal form, and TIN LEAD finish. Ideal for telecom applications like ATM, SDH, and SONET due to its serial-to-parallel conversion capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,583 parts In-Stock

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1,583

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Digiode

USA . 630 parts In-Stock

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630

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,995 parts In-Stock

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7,995

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Problanco Electronics

Mexico . 3,622 parts In-Stock

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3,622

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Kulean Microsystems

USA . 2,411 parts In-Stock

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2,411

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Corphita

USA . 474 parts In-Stock

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474

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UHIMA Technologies

Türkiye . 307 parts In-Stock

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307

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Corohmni

South Africa . 81 parts In-Stock

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81

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TANS Electronics

Latvia . 53 parts In-Stock

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Overview

Enhance your networking solutions with the MC10SX1405FJR2 by Onsemi, a high-quality ATM/SONET/SDH circuit designed to deliver top-notch performance and reliability. With a focus on innovation and precision engineering, Onsemi ensures that their products meet the highest industry standards. This versatile chip carrier package is ideal for applications in ATM, SDH, and SONET technologies, offering seamless conversion from serial to parallel and vice versa. Trust Onsemi to provide you with the cutting-edge technology you need to stay ahead in today's fast-paced telecom market, delivering value, benefits, and advantages that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body material provides durability and protection for the internal components, ensuring reliable performance even in harsh conditions.

Surface Mount: YES

Being surface mountable makes it easy to integrate this product into existing circuit boards, saving space and simplifying installation.

Power Supplies (V): 5

The 5V power supply requirement is common and easily achievable, making it compatible with a wide range of systems and applications.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, reducing the risk of signal interference or loss.

Applications: ATM; SDH; SONET

Support for ATM, SDH, and SONET applications makes this product versatile and suitable for a variety of communication networks and systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can perform reliably in high-temperature environments without overheating.

Technology: ECL10K

The ECL10K technology ensures efficient and fast data processing, making this product ideal for high-speed data transmission in ATM, SDH, and SONET networks.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures consistent and stable power delivery, contributing to the overall reliability and performance of the product.

Technical Specifications

ATM/SONET/SDH Circuits MC10SX1405FJR2 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Onsemi

Specs

Applications:

ATM; SDH; SONET

JESD-30 Code:

S-GQCC-J52

JESD-609 Code:

e0

Length:

18.935 mm

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

18.935 mm

Trade Compliance

MC10SX1405FJR2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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