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HMC706LC3CTR

Analog Devices

HMC706LC3CTR by Analog Devices

Analog Devices' HMC706LC3CTR is an ATM/SONET/SDH network interface IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm, ideal for telecom systems requiring high reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,097 parts In-Stock

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5,097

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Digiode

USA . 364 parts In-Stock

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364

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Distributors (Availability)

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AZTECH Wire

Italy . 872 parts In-Stock

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$8.466

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872

$8.466

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Parana Technologies

USA . 1,078 parts In-Stock

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$11.052

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$10.278

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IDEA Electronic Components Group

UK . 256 parts In-Stock

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$11.884

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$11.290

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$11.290

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256

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$11.290

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DigiPath Technology Company

USA . 1,302 parts In-Stock

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$18.539

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$17.797

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$17.797

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$17.797

Semicontronic

India . 1,641 parts In-Stock

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$340.000

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$331.500

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$329.800

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One Stop Electronics

USA . 1,226 parts In-Stock

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$612.000

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QUARKTWIN TECHNOLOGY LTD

USA . 4,294 parts In-Stock

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Corphita

USA . 222 parts In-Stock

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Overview

Upgrade your network with the HMC706LC3CTR from Analog Devices, a leading manufacturer known for top-quality ATM/SONET/SDH circuits. This versatile chip carrier package offers exceptional reliability and performance, making it ideal for a wide range of telecom applications. With a temperature range of -40 to 85 °C and a nominal supply voltage of 3.3V, this industrial-grade solution provides unbeatable value and benefits to customers looking to enhance their network infrastructure. Trust Analog Devices to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and protection for the internal components, increasing the overall reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into existing circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square shape of the package helps optimize space on the circuit board, allowing for more efficient design layouts.

No. of Terminals: 16

Having 16 terminals allows for a variety of connections and signal pathways, increasing the versatility and functionality of the product.

Package Style: CHIP CARRIER

The chip carrier style of packaging offers a compact and lightweight design, ideal for applications where space is limited.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging thermal environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product remains functional even in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections, minimizing the risk of signal loss or interference.

Maximum Seated Height: 1.31 mm

The low maximum seated height helps reduce the overall profile of the product, making it suitable for applications with limited space constraints.

Width: 3 mm

The compact width of the product enables efficient placement on the circuit board, optimizing the layout and improving overall system performance.

Length: 3 mm

The short length of the product further enhances its space-saving capabilities, ideal for applications requiring a compact design.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product can withstand demanding operating conditions and maintain reliable performance in harsh environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of solder joints cracking or failing, ensuring long-term reliability.

Telecom IC Type: ATM/SONET/SDH NETWORK INTERFACE

Featuring advanced networking capabilities, this product is well-suited for telecommunications applications requiring high-speed data transmission and efficient network management.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage is commonly used in electronic systems, providing compatibility with a wide range of devices and power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for precise connections and signal routing, ensuring reliable performance and signal integrity in high-speed applications.

Technical Specifications

ATM/SONET/SDH Circuits HMC706LC3CTR attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

JESD-30 Code:

S-CQCC-N16

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

1.31 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

HMC706LC3CTR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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