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MC10SX1125D

Onsemi

MC10SX1125D by Onsemi

MC10SX1125D by Onsemi is a 16-terminal ATM/SONET/SDH circuit in small outline package. Operates at -40 to 85 °C with 5V supply, suitable for telecom applications like ATM, SDH, and SONET. Utilizes ECL10K technology with GULL WING terminals and 1.27mm pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 1,651 parts In-Stock

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Digiode

USA . 1,456 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Electronics Depot

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SupplyDigital Components

Austria . 8,279 parts In-Stock

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Kulean Microsystems

USA . 4,866 parts In-Stock

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Problanco Electronics

Mexico . 4,069 parts In-Stock

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TANS Electronics

Latvia . 2,787 parts In-Stock

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Perfect Parts

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Corphita

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Corohmni

South Africa . 125 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 96 parts In-Stock

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UHIMA Technologies

Türkiye . 91 parts In-Stock

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Overview

Experience cutting-edge technology with the MC10SX1125D by Onsemi, a top-of-the-line ATM/SONET/SDH circuit designed for high-performance applications in the telecom industry. With a focus on quality and reliability, Onsemi delivers a product that exceeds expectations. This compact and versatile device offers customers unparalleled value, providing seamless integration and optimal functionality for your networking needs. Upgrade your systems with the MC10SX1125D and enjoy the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for use in telecommunications equipment.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the product onto circuit boards, saving time and effort during production.

Power Supplies (V): 5

The 5V power supply requirement is common in many electronic systems, making this product compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperatures and provide reliable performance in various environments.

Applications: ATM; SDH; SONET

The product is designed to support ATM, SDH, and SONET technologies, making it versatile and suitable for a range of networking applications.

Technology: ECL10K

The use of ECL10K technology ensures high-speed and efficient operation, making it ideal for use in advanced networking systems.

Technical Specifications

ATM/SONET/SDH Circuits MC10SX1125D attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Onsemi

Specs

Applications:

ATM; SDH; SONET

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.045 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC10SX1125D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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