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HMC699LP5

Analog Devices

HMC699LP5 by Analog Devices

Analog Devices' HMC699LP5 is a 32-terminal chip carrier with a square shape and very thin profile. It operates in industrial temperature range (-40 to 85°C) and supports ATM/SONET/SDH circuits at 5V supply voltage. Ideal for telecom applications, this surface-mount IC has tin/lead terminal finish and quad position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,934 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,934

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-

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Digiode

USA . 167 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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167

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,027 parts In-Stock

1+ parts

$12.740

100+ parts

-

1k+ parts

$11.848

10k+ parts

-

2,027

$12.740

-

$11.848

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IDEA Electronic Components Group

UK . 1,736 parts In-Stock

1+ parts

$13.699

100+ parts

$13.014

1k+ parts

$13.014

10k+ parts

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1,736

$13.699

$13.014

$13.014

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AZTECH Wire

Italy . 594 parts In-Stock

1+ parts

$13.941

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-

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594

$13.941

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DigiPath Technology Company

USA . 1,732 parts In-Stock

1+ parts

$21.370

100+ parts

$20.516

1k+ parts

-

10k+ parts

$20.516

1,732

$21.370

$20.516

-

$20.516

One Stop Electronics

USA . 1,569 parts In-Stock

1+ parts

$676.000

100+ parts

-

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10k+ parts

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1,569

$676.000

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Semicontronic

India . 749 parts In-Stock

1+ parts

$883.000

100+ parts

$860.925

1k+ parts

$856.510

10k+ parts

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749

$883.000

$860.925

$856.510

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Corphita

USA . 606 parts In-Stock

1+ parts

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606

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Overview

Upgrade your telecom systems with the HMC699LP5 by Analog Devices, a top-tier ATM/SONET/SDH circuit designed for industrial-grade performance. With a package body material of plastic/epoxy and surface mount capability, this chip carrier offers 32 terminals in a very thin profile, making it ideal for space-constrained applications. Trust Analog Devices' reputation for excellence in telecommunications technology to deliver the quality and reliability your business needs. Experience the value and benefits of the HMC699LP5's superior performance and precision engineering, setting your systems apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

Square package shape saves space on the circuit board and provides a tidy layout.

No. of Terminals: 32

High number of terminals allows for complex circuit connections and functionalities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation and a slim profile for space-saving designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good conductivity and solderability for secure connections.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of connections and signal flow.

Maximum Seated Height: 1 mm

Low maximum seated height saves vertical space on the circuit board.

Width: 5 mm

Compact width allows for close placement of components on the board.

Length: 5 mm

Short length conserves space and enables a compact overall design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures high performance and reliability in demanding industrial environments.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and is safer for handling.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Designed specifically for ATM/SONET/SDH circuits, ensuring compatibility and optimal performance.

Nominal Supply Voltage: 5 V

5V nominal supply voltage is common and easily obtainable, simplifying power requirements.

Terminal Pitch: 0.5 mm

Fine 0.5mm terminal pitch allows for densely packed connections on the circuit board.

Technical Specifications

ATM/SONET/SDH Circuits HMC699LP5 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

HMC699LP5 Telecommunications trade compliance attributes, and parameters.

ECCN

3A001.A.11.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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