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HMC698LP5

Analog Devices

HMC698LP5 by Analog Devices

Analog Devices' HMC698LP5 is a 32-terminal ATM/SONET/SDH circuit in a square chip carrier package. With an operating temperature range of -40 to 85°C, it supports a nominal voltage of 5V. Ideal for telecom applications requiring very thin profile components with surface mount capability.

Median Price

$15.243

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$15.243

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50

$15.243

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Vyrian

USA . 5,028 parts In-Stock

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5,028

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Digiode

USA . 636 parts In-Stock

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636

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$10.103

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568

$10.103

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Parana Technologies

USA . 1,293 parts In-Stock

1+ parts

$16.413

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$15.264

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1,293

$16.413

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IDEA Electronic Components Group

UK . 788 parts In-Stock

1+ parts

$17.648

100+ parts

$16.766

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$16.766

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788

$17.648

$16.766

$16.766

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DigiPath Technology Company

USA . 3,044 parts In-Stock

1+ parts

$27.531

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$26.430

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$26.430

3,044

$27.531

$26.430

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$26.430

Semicontronic

India . 1,130 parts In-Stock

1+ parts

$870.000

100+ parts

$848.250

1k+ parts

$843.900

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1,130

$870.000

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One Stop Electronics

USA . 825 parts In-Stock

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$956.000

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Corphita

USA . 968 parts In-Stock

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Microchip USA

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Overview

Upgrade your networking capabilities with the HMC698LP5 by Analog Devices. This top-of-the-line ATM/SONET/SDH circuit offers unparalleled quality and reliability, backed by the trusted manufacturer, Analog Devices. With its advanced technology and innovative design, this product ensures seamless performance in a wide range of applications. Experience the value and benefits of this cutting-edge solution, providing customers with superior connectivity and efficiency. Elevate your network infrastructure with the HMC698LP5 and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for telecom applications where weight and durability are important factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

Square shape provides a compact form factor, saving space on the circuit board and allowing for dense packing of components.

No. of Terminals: 32

Having 32 terminals allows for versatile connections and compatibility with a wide range of other components in the circuit.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation, enabling the product to operate at a maximum temperature of 85°C without overheating.

Maximum Operating Temperature: 85 °C

The ability to operate at a high temperature of 85°C makes this product suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the product can withstand extreme cold conditions, providing reliability in harsh environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish ensures a reliable connection and compatibility with various soldering processes, enhancing the product's durability.

Terminal Position: QUAD

Quad terminal position allows for more secure and stable connections, preventing signal loss or interference in high-frequency applications.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, the product is suitable for compact designs where space constraints are a concern.

Width: 5 mm

The 5 mm width offers a small footprint, allowing for efficient use of space on the circuit board and enabling high-density integration of components.

Length: 5 mm

The 5 mm length contributes to the product's compact form factor, making it suitable for applications where size limitations are critical.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments, making the product suitable for rugged applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with regulations, making the product a sustainable choice for eco-conscious users.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Designed specifically for ATM/SONET/SDH circuits, this product offers robust support for telecom applications, ensuring efficient and reliable performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V, the product is compatible with standard power sources, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for fine-pitch connections, enabling high-speed data transmission and ensuring signal integrity in telecom applications.

Technical Specifications

ATM/SONET/SDH Circuits HMC698LP5 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

HMC698LP5 Telecommunications trade compliance attributes, and parameters.

ECCN

3A001.A.11.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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