Loading...

MC10SX1126D

Onsemi

MC10SX1126D by Onsemi

MC10SX1126D by Onsemi is an ATM/SONET/SDH circuit with 16 terminals, operating at 5V. It has a small outline package style, GULL WING terminal form, and supports ECL technology. Ideal for industrial applications like ATM and SONET due to its low supply current of 0.045mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,914

-

-

-

-

Digiode

USA . 1,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,256

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,261 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,261

-

-

-

-

TANS Electronics

Latvia . 5,562 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,562

-

-

-

-

SupplyDigital Components

Austria . 5,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,407

-

-

-

-

Kulean Microsystems

USA . 3,109 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,109

-

-

-

-

Corphita

USA . 558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

558

-

-

-

-

UHIMA Technologies

Türkiye . 476 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

476

-

-

-

-

Corohmni

South Africa . 396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

396

-

-

-

-

Overview

Experience unparalleled quality and reliability with the MC10SX1126D by Onsemi, a leading manufacturer in the industry. This cutting-edge ATM/SONET/SDH circuit offers a wide range of applications in the telecom sector, providing customers with seamless connectivity and exceptional performance. With a compact design and industrial-grade temperature rating, this product ensures optimal functionality in any environment. Trust Onsemi to deliver top-notch products like the MC10SX1126D that exceed expectations and elevate your business operations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy in the package body material makes the product lightweight and durable, making it easy to handle and resistant to damage.

Surface Mount: YES

Being surface mountable allows for easy installation and more efficient use of space on a circuit board.

Power Supplies (V): 5

The 5V power supply makes it compatible with standard power sources, ensuring easy integration into existing systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures that the product can function reliably even in demanding environments.

Applications: ATM; SONET

The product is specifically designed for ATM and SONET applications, making it a suitable choice for telecommunications systems that require high-speed data transfer.

Technical Specifications

ATM/SONET/SDH Circuits MC10SX1126D attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Onsemi

Specs

Applications:

ATM; SONET

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.045 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC10SX1126D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 16