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ZL30165GDG2

Microchip Technology

ZL30165GDG2 by Microchip Technology

ZL30165GDG2 by Microchip: Industrial grade ATM/SONET/SDH circuit with 144 terminals in a square grid array package. Operates b/w -40 to 85 °C, supporting SONET and SDH applications. Features 1.8V supply voltage, 242mA max supply current, and bottom terminal position for telecom use.

Median Price

$103.200

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,725 parts In-Stock

1+ parts

$103.200

100+ parts

$78.200

1k+ parts

$72.260

10k+ parts

$68.520

2,725

$103.200

$78.200

$72.260

$68.520

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 2,240 parts In-Stock

1+ parts

$94.940

100+ parts

$87.450

1k+ parts

$81.050

10k+ parts

-

2,240

$94.940

$87.450

$81.050

-

Vyrian

USA . 3,504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,504

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-

-

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

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600

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-

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Martec Srl

Italy . 8 parts In-Stock

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-

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-

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,216 parts In-Stock

1+ parts

$12.560

100+ parts

-

1k+ parts

-

10k+ parts

-

1,216

$12.560

-

-

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Corohmni

South Africa . 191 parts In-Stock

1+ parts

$12.713

100+ parts

-

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10k+ parts

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191

$12.713

-

-

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Ampacity Inc.

Singapore . 504 parts In-Stock

1+ parts

$87.720

100+ parts

-

1k+ parts

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504

$87.720

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-

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Component Stockers USA

USA . 189 parts In-Stock

1+ parts

$101.240

100+ parts

$76.710

1k+ parts

-

10k+ parts

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189

$101.240

$76.710

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West Coast Incorporated

USA . 6,888 parts In-Stock

1+ parts

-

100+ parts

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6,888

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Continental Prestige Electronics

USA . 4,079 parts In-Stock

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4,079

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Argo Parts USA

USA . 2,677 parts In-Stock

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2,677

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Overview

Enhance your network systems with the ZL30165GDG2 by Microchip Technology, a top-tier manufacturer known for its quality products. This ATM/SONET/SDH circuit offers unparalleled reliability and performance, making it ideal for SONET and SDH applications. With its advanced features and industrial-grade temperature grade, this product ensures seamless communication and operation. Upgrade your telecom infrastructure today with the ZL30165GDG2 and experience the value and benefits it brings to your network connectivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight, durable, and cost-effective, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and providing efficient connectivity.

Package Shape: SQUARE

The square shape of the package makes it easier to arrange and place multiple components on a circuit board, optimizing space usage.

No. of Terminals: 144

With a high number of terminals, this product allows for multiple connections, enhancing its versatility and functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in varying environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively even in extreme cold environments.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage helps in reducing power consumption and is suitable for telecom applications where energy efficiency is crucial.

Technical Specifications

ATM/SONET/SDH Circuits ZL30165GDG2 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

Applications:

SONET;SDH

JESD-30 Code:

S-PBGA-B144

Length:

13 mm

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA144,12X12,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1.95 mm

Maximum Supply Current:

242 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

13 mm

Trade Compliance

ZL30165GDG2 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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