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ZL30123GGG2

Microchip Technology

ZL30123GGG2 by Microchip Technology

Microchip Technology's ZL30123GGG2 is an ATM/SONET/SDH circuit in a square grid array package. It operates b/w -40°C to 85°C, with a terminal pitch of 0.8mm and nominal voltage of 1.8V. Ideal for SDH and SONET applications, it features a bottom terminal position with tin silver copper finish.

Median Price

$68.260

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 4,160 parts In-Stock

1+ parts

$68.260

100+ parts

$51.720

1k+ parts

$47.780

10k+ parts

$45.310

4,160

$68.260

$51.720

$47.780

$45.310

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 21 parts In-Stock

1+ parts

$58.051

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$58.051

-

-

-

NAC Semi

USA . 3,380 parts In-Stock

1+ parts

$62.800

100+ parts

$57.840

1k+ parts

$53.610

10k+ parts

-

3,380

$62.800

$57.840

$53.610

-

Vyrian

USA . 5,712 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,712

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 152 parts In-Stock

1+ parts

$11.659

100+ parts

-

1k+ parts

-

10k+ parts

-

152

$11.659

-

-

-

Aztec Data Supply Inc.

USA . 10 parts In-Stock

1+ parts

$14.980

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$14.980

-

-

-

Continental Prestige Electronics

USA . 3,104 parts In-Stock

1+ parts

$58.051

100+ parts

-

1k+ parts

-

10k+ parts

$56.890

3,104

$58.051

-

-

$56.890

Netroflash

USA . 100 parts In-Stock

1+ parts

$58.051

100+ parts

-

1k+ parts

$55.148

10k+ parts

$53.987

100

$58.051

-

$55.148

$53.987

QUARKTWIN TECHNOLOGY LTD

USA . 25,731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,731

-

-

-

-

Marpe Global Electronics

Taiwan . 5,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,240

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

QualityLine Systems

Poland . 4,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,230

-

-

-

-

XL Components Corporation

Australia . 3,569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,569

-

-

-

-

Argo Parts USA

USA . 243 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

243

-

-

-

-

Overview

Enhance your network infrastructure with the ZL30123GGG2 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures superior quality and reliability. This ATM/SONET/SDH circuit is designed for high-performance applications, providing seamless integration and efficient operation. With its advanced features and innovative technology, this product offers customers unmatched value, benefits, and advantages. Upgrade your telecom system with the ZL30123GGG2 and experience enhanced performance and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components in various environments.

Surface Mount: YES

Allows for easy installation and integration into existing circuit boards.

Package Shape: SQUARE

Compact design that saves space and allows for efficient placement on PCBs.

No. of Terminals: 100

Provides a high level of connectivity for complex circuit configurations.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperature conditions without impacting functionality.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and prevents corrosion for long-term usage.

Terminal Position: BOTTOM

Facilitates easy soldering and connection to other components.

Width: 9 mm

Compact size that allows for dense packing of components on PCBs.

Length: 9 mm

Symmetrical dimensions for uniform placement and alignment during installation.

Temperature Grade: INDUSTRIAL

Meets industrial-grade standards for reliability and performance in harsh conditions.

Applications: SDH; SONET

Specifically designed to support SDH and SONET technologies for telecom applications.

Nominal Supply Voltage: 1.8 V

Operates efficiently with low power consumption at a standard voltage level.

Terminal Pitch: 0.8 mm

Fine pitch spacing allows for high-density routing of connections on PCBs.

Technical Specifications

ATM/SONET/SDH Circuits ZL30123GGG2 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

9 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.72 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Trade Compliance

ZL30123GGG2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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