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ZL30108LDG1

Microchip Technology

ZL30108LDG1 by Microchip Technology

ZL30108LDG1 by Microchip: Telecom IC for SDH & SONET applications. Features 32 terminals, 1.8V supply voltage, and -40 to 85°C operating temp range. Package style is chip carrier with a very thin profile.

Median Price

$38.080

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,960 parts In-Stock

1+ parts

$38.080

100+ parts

$28.860

1k+ parts

$26.650

10k+ parts

$25.280

1,960

$38.080

$28.860

$26.650

$25.280

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$34.093

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$34.093

-

-

-

NAC Semi

USA . 980 parts In-Stock

1+ parts

$35.040

100+ parts

$32.280

1k+ parts

$29.910

10k+ parts

-

980

$35.040

$32.280

$29.910

-

Vyrian

USA . 3,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,999

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 97 parts In-Stock

1+ parts

$13.787

100+ parts

-

1k+ parts

-

10k+ parts

-

97

$13.787

-

-

-

Corohmni

South Africa . 69 parts In-Stock

1+ parts

$15.216

100+ parts

-

1k+ parts

-

10k+ parts

-

69

$15.216

-

-

-

Continental Prestige Electronics

USA . 6,081 parts In-Stock

1+ parts

$34.093

100+ parts

-

1k+ parts

-

10k+ parts

$33.411

6,081

$34.093

-

-

$33.411

Netroflash

USA . 100 parts In-Stock

1+ parts

$34.093

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$34.093

-

-

-

Fulton Briggs Corp.

USA . 2,806 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,806

-

-

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Argo Parts USA

USA . 535 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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535

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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500

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Overview

Unlock the full potential of your network with the ZL30108LDG1 by Microchip Technology. Designed for ATM/SONET/SDH circuits, this cutting-edge product offers unparalleled quality and reliability. With a sleek square package shape and 32 terminals, this chip carrier boasts a very thin profile and maximum operating temperature of 85°C. Ideal for SDH and SONET applications, this Industrial-grade telecom IC will revolutionize your network interface. Experience the value and benefits that only Microchip Technology can deliver. Elevate your network performance with the ZL30108LDG1.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, making this product suitable for modern PCB assembly processes.

Package Shape: SQUARE

The square package shape provides a compact and efficient design, ideal for space-constrained applications.

No. of Terminals: 32

With 32 terminals, this product offers a high level of connectivity for complex circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows this product to function effectively in both extreme cold and hot temperatures.

Terminal Position: QUAD

The quad terminal position provides stable connections and facilitates easy integration into circuit designs.

Maximum Seated Height: 1 mm

The low seated height of 1 mm contributes to a slim profile and helps conserve space in compact electronic devices.

Width: 5 mm

The 5 mm width offers a balance between compactness and ease of handling during installation.

Length: 5 mm

The 5 mm length contributes to a square form factor, optimizing space utilization on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Applications: SDH; SONET

Designed for specific applications such as SDH and SONET, making it suitable for telecommunications networking equipment.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage of 1.8 V results in energy-efficient operation and reduced power consumption.

Maximum Supply Current: 43 mA

The maximum supply current of 43 mA indicates efficient power usage and lower operational costs.

Telecom IC Type: ATM/SONET/SDH NETWORK INTERFACE

The specific telecom IC type indicates compatibility with ATM, SONET, and SDH protocols, making it a versatile choice for networking applications.

Terminal Form: NO LEAD

The no lead terminal form enhances reliability and signal integrity, crucial for high-speed data transmission in telecom networks.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density interconnection and precise signal routing on the PCB.

Technical Specifications

ATM/SONET/SDH Circuits ZL30108LDG1 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Current:

43 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ZL30108LDG1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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