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MC10SX1405FJ

Onsemi

MC10SX1405FJ by Onsemi

MC10SX1405FJ by Onsemi is an ATM/SONET/SDH Circuits chip carrier with 52 terminals, operating at 5V. It has a temperature range of -40 to 85 °C and uses ECL10K technology. Ideal for ATM, SDH, and SONET applications as a serial to parallel converter.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,306 parts In-Stock

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Vyrian

USA . 276 parts In-Stock

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276

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Distributors (Availability)

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Problanco Electronics

Mexico . 6,511 parts In-Stock

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6,511

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Kulean Microsystems

USA . 2,078 parts In-Stock

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2,078

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TANS Electronics

Latvia . 1,184 parts In-Stock

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UHIMA Technologies

Türkiye . 836 parts In-Stock

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836

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Corohmni

South Africa . 201 parts In-Stock

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SupplyDigital Components

Austria . 150 parts In-Stock

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150

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Corphita

USA . 114 parts In-Stock

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Overview

Unleash the power of seamless communication with the MC10SX1405FJ by Onsemi. Crafted with precision and expertise, this ATM/SONET/SDH circuit offers unparalleled performance and reliability. Perfect for a wide range of applications in the telecom industry such as ATM, SDH, and SONET, this product promises to streamline your operations and elevate your network capabilities. With Onsemi's reputation for innovation and quality, you can trust that the MC10SX1405FJ is the solution you need to stay ahead of the curve. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body material provides durability and protection, making this product suitable for industrial applications.

Surface Mount: YES

Being surface mountable allows for easy installation and saves space, making it a convenient choice for integration into various systems.

Power Supplies (V): 5

Operating at 5V makes this product energy efficient and compatible with standard power sources.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact design and efficient heat dissipation, contributing to the overall performance of the product.

Applications: ATM; SDH; SONET

The compatibility with various applications such as ATM, SDH, and SONET makes this product versatile and suitable for telecommunications networks.

Technical Specifications

ATM/SONET/SDH Circuits MC10SX1405FJ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Onsemi

Specs

Applications:

ATM; SDH; SONET

JESD-30 Code:

S-GQCC-J52

JESD-609 Code:

e0

Length:

18.935 mm

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

18.935 mm

Trade Compliance

MC10SX1405FJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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