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HMC856LC5TR-R5

Analog Devices

HMC856LC5TR-R5 by Analog Devices

HMC856LC5TR-R5 by Analog Devices is an ATM/SONET/SDH clock recovery circuit with a square package and 32 terminals. It operates in industrial temperature range (-40 to 85 °C) and has a max seated height of 1.12 mm. This telecom IC is surface mountable and has a terminal finish of gold over nickel, making it suitable for various communication applications.

Median Price

$248.910

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 91 parts In-Stock

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$248.910

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91

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Vyrian

USA . 4,179 parts In-Stock

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4,179

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Digiode

USA . 71 parts In-Stock

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71

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 202 parts In-Stock

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$5.725

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$5.324

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202

$5.725

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$5.324

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IDEA Electronic Components Group

UK . 1,824 parts In-Stock

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$6.156

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$5.848

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1,824

$6.156

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$5.848

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AZTECH Wire

Italy . 454 parts In-Stock

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$7.908

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454

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DigiPath Technology Company

USA . 1,813 parts In-Stock

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$9.603

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$9.219

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Ampacity Inc.

Singapore . 1,235 parts In-Stock

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$122.000

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Vigor

Singapore . 847 parts In-Stock

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$202.776

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847

$202.776

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Continental Prestige Electronics

USA . 6,509 parts In-Stock

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$248.910

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$243.932

6,509

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$243.932

Netroflash

USA . 50 parts In-Stock

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$248.910

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Microchip USA

USA . 2,399 parts In-Stock

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$373.365

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2,399

$373.365

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One Stop Electronics

USA . 398 parts In-Stock

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$425.000

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398

$425.000

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Semicontronic

India . 475 parts In-Stock

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$864.000

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$842.400

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$838.080

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475

$864.000

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$838.080

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Argo Parts USA

USA . 2,314 parts In-Stock

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Corphita

USA . 766 parts In-Stock

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766

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Overview

Discover the HMC856LC5TR-R5 by Analog Devices, a game-changing ATM/SONET/SDH circuit that combines top-notch quality with unmatched performance. Manufactured by the industry leader Analog Devices, this cutting-edge chip offers numerous advantages for telecom applications. With its ceramic, metal-sealed co-fired package body material and gold over nickel terminal finish, this product guarantees reliability and durability. Boasting a wide operating temperature range of -40°C to 85°C, it is perfect for industrial use. Its compact square shape and surface mount capability make it easy to integrate into any design. Don't miss out on this innovative solution that brings immense value and benefits to our customers.

Feature Benefit Bullets

Package Body Material:

CERAMIC, METAL-SEALED COFIRED. This material ensures durability and reliability, making it an excellent choice for long-term use in ATMs, SONET, and SDH circuits.

Surface Mount:

YES. The surface mount feature allows for easy installation and integration into various circuit systems, enhancing the overall efficiency and convenience of this product.

No. of Functions:

1. With a single function, this circuit simplifies the design and implementation process, reducing complexity and ensuring straightforward operation.

Package Shape:

SQUARE. The square shape provides a compact footprint, enabling efficient use of space and making it ideal for applications where size matters.

No. of Terminals:

32. The higher number of terminals offers enhanced connectivity options, facilitating seamless integration with other components and systems.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG. This package style ensures effective heat dissipation, preventing overheating and enabling the circuit to operate optimally for extended periods.

Maximum Operating Temperature:

85 °C. The high maximum operating temperature allows this circuit to function reliably in harsh environments and ensures stability during demanding operations.

Minimum Operating Temperature:

40 °C. The low minimum operating temperature ensures the circuit remains functional even in extreme cold conditions, making it suitable for diverse environmental settings.

Terminal Finish:

GOLD OVER NICKEL. The gold over nickel terminal finish enhances conductivity, providing excellent signal transmission and reducing the risk of corrosion, thereby improving the overall performance and longevity of the product.

Terminal Position:

QUAD. The quad terminal position facilitates easy and secure connections, enabling efficient installation and reducing the chance of signal disruptions.

Maximum Seated Height:

1.12 mm. The low maximum seated height contributes to a slim and compact design, allowing for flexible placement within tight spaces, optimizing circuit board layouts.

Width:

5 mm. The narrow width of this product makes it suitable for applications with space constraints, ensuring compatibility with various equipment and systems.

Maximum Time At Peak Reflow Temperature (s):

30. The extended duration at the peak reflow temperature allows for thorough soldering and proper bonding, promoting reliable performance and preventing solder joint defects.

Peak Reflow Temperature °C:

260. The high peak reflow temperature ensures effective soldering, reducing the risk of soldering issues and enhancing the overall quality and reliability of the product.

Length:

5 mm. The compact length of this circuit ensures easy integration and compatibility with a wide range of devices and systems, providing flexibility in design and implementation.

Temperature Grade:

INDUSTRIAL. This temperature grade classification indicates that the circuit is designed to withstand industrial-level temperature ranges, making it suitable for demanding applications in rugged environments.

Nominal Negative Supply Voltage:

3.3 V. The negative supply voltage ensures stable operation and reliable performance, accommodating various system requirements and contributing to the circuit's versatility.

Terminal Form:

NO LEAD. The no lead terminal form simplifies the manufacturing process and facilitates automated assembly, reducing production costs and ensuring consistent product quality.

Telecom IC Type:

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT. This specific IC type is tailored for ATM, SONET, and SDH applications, ensuring accurate clock recovery and synchronization, making it a highly suitable choice for telecommunications-related circuits.

Terminal Pitch:

0.5 mm. The tight terminal pitch allows for higher density connections, enabling the circuit to be used in compact designs without compromising performance, thereby optimizing space usage.

Moisture Sensitivity Level (MSL):

3. With an MSL rating of 3, this circuit can withstand moderate moisture exposure, ensuring reliability in normal operating conditions.

Technical Specifications

ATM/SONET/SDH Circuits HMC856LC5TR-R5 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

JESD-30 Code:

S-CQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-3.3 V

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.12 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

HMC856LC5TR-R5 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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