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LMK04111SQX/NOPB

Texas Instruments

LMK04111SQX/NOPB by Texas Instruments

LMK04111SQX/NOPB by Texas Instruments is a 48-terminal chip carrier with matte tin finish. It operates b/w -40 to 85°C, ideal for SDH and SONET applications. With a nominal voltage of 3.3V, it supports ATM/SONET/SDH circuits in industrial-grade environments.

Median Price

$8.765

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,950 parts In-Stock

1+ parts

$8.765

100+ parts

$7.656

1k+ parts

$5.280

10k+ parts

-

4,950

$8.765

$7.656

$5.280

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,049 parts In-Stock

1+ parts

$8.327

100+ parts

-

1k+ parts

-

10k+ parts

-

4,049

$8.327

-

-

-

Vyrian

USA . 4,451 parts In-Stock

1+ parts

$8.765

100+ parts

-

1k+ parts

-

10k+ parts

-

4,451

$8.765

-

-

-

Anansix

USA . 111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

111

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,179 parts In-Stock

1+ parts

$6.905

100+ parts

-

1k+ parts

$7.510

10k+ parts

-

2,179

$6.905

-

$7.510

-

DigiPath Technology Company

USA . 2,029 parts In-Stock

1+ parts

$7.603

100+ parts

-

1k+ parts

-

10k+ parts

-

2,029

$7.603

-

-

-

ChromeModa Solutions

Germany . 3,100 parts In-Stock

1+ parts

$7.758

100+ parts

$6.362

1k+ parts

-

10k+ parts

-

3,100

$7.758

$6.362

-

-

IDEA Electronic Components Group

UK . 1,139 parts In-Stock

1+ parts

$7.758

100+ parts

-

1k+ parts

$6.982

10k+ parts

-

1,139

$7.758

-

$6.982

-

Corphita

USA . 2,473 parts In-Stock

1+ parts

$7.888

100+ parts

-

1k+ parts

-

10k+ parts

-

2,473

$7.888

-

-

-

Andel Nordic

Denmark . 408 parts In-Stock

1+ parts

$10.893

100+ parts

-

1k+ parts

$10.457

10k+ parts

$10.457

408

$10.893

-

$10.457

$10.457

Ampacity Inc.

Singapore . 4,628 parts In-Stock

1+ parts

$16.220

100+ parts

-

1k+ parts

-

10k+ parts

-

4,628

$16.220

-

-

-

Microchip USA

USA . 1,187 parts In-Stock

1+ parts

$19.110

100+ parts

$18.840

1k+ parts

$18.700

10k+ parts

$18.570

1,187

$19.110

$18.840

$18.700

$18.570

Overview

Unlock the power of cutting-edge technology with the LMK04111SQX/NOPB by Texas Instruments. This ATM/SONET/SDH circuit boasts top-tier quality and reliability, backed by a renowned manufacturer. Ideal for SDH and SONET applications, this versatile chip provides unparalleled performance and efficiency. With a wide temperature range and industrial-grade durability, this product offers exceptional value and benefits to customers seeking a high-quality solution for their telecom needs. Trust in Texas Instruments for innovative solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for telecommunications equipment.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and reducing assembly time.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability in various environmental conditions.

Nominal Supply Voltage: 3.3 V

Compatible with standard 3.3V power supply, making it easy to integrate into existing systems.

Applications: SDH; SONET

Specifically designed for SDH and SONET applications, ensuring optimal performance in telecom networks.

Technical Specifications

ATM/SONET/SDH Circuits LMK04111SQX/NOPB attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMK04111SQX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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