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ADN2811ACP-CML-RL

Analog Devices

ADN2811ACP-CML-RL by Analog Devices

Analog Devices' ADN2811ACP-CML-RL is a 48-terminal ATM/SONET/SDH circuit with 3.3V supply, suitable for SDH and SONET applications. It operates b/w -40 to 85 °C, in a square package measuring 7x7mm, with a low supply current of 0.215mA.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,581 parts In-Stock

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Digiode

USA . 62 parts In-Stock

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Parana Technologies

USA . 2,271 parts In-Stock

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$10.378

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$9.651

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$10.378

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$9.651

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IDEA Electronic Components Group

UK . 1,807 parts In-Stock

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$11.159

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$10.601

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$10.601

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AZTECH Wire

Italy . 867 parts In-Stock

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$12.192

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Native Components

USA . 524 parts In-Stock

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$12.689

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Northwest PG Solutions

USA . 1,702 parts In-Stock

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$13.957

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$12.562

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DigiPath Technology Company

USA . 290 parts In-Stock

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$17.408

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$16.712

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$16.712

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$16.712

Semicontronic

India . 794 parts In-Stock

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$38.000

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$37.050

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$36.860

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One Stop Electronics

USA . 606 parts In-Stock

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$158.000

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Corphita

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Overview

Enhance your network's performance with the ADN2811ACP-CML-RL by Analog Devices. As a leader in ATM/SONET/SDH circuits, Analog Devices delivers top-quality products that guarantee reliability and efficiency. This versatile chip carrier with a very thin profile is perfect for SDH and SONET applications, offering a seamless integration into your telecom systems. With a nominal supply voltage of 3.3V and low supply current, this industrial-grade device ensures optimal functionality while maximizing power efficiency. Upgrade your network infrastructure with Analog Devices today and experience superior performance like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and cost.

Package Shape: SQUARE

Square shape package results in better space utilization and compatibility with various assembly layouts.

Power Supplies (V): 3.3

Operating at 3.3V voltage ensures compatibility with standard power supplies and reduces power consumption.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with other components and systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers efficient heat dissipation, compact profile, and easy integration into compact designs.

Maximum Operating Temperature: 85 °C

Ability to operate at higher temperatures ensures reliability and stability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Being able to operate at low temperatures makes this product suitable for a wide range of applications and environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and conductivity, ensuring reliable connections.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of signals and reduces signal interference.

Maximum Seated Height: 1 mm

Low seated height makes this product suitable for applications with space constraints and ensures easy integration.

Width: 7 mm

Compact width allows for efficient board utilization and integration in compact designs.

Peak Reflow Temperature °C: 240

High peak reflow temperature ensures reliable solder joints and robust assembly.

Length: 7 mm

Compact length enables efficient board layout and integration in space-limited designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating environments.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, providing optimized performance in these scenarios.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of lead contamination and ensures RoHS compliance.

Maximum Supply Current: 0.215 mA

Low maximum supply current consumption helps in reducing power consumption and heat generation.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

Specifically designed for telecom applications, ensuring reliable clock recovery operations in ATM, SONET, and SDH networks.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and enables efficient power management.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and efficient use of PCB real estate.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the component can handle moderate exposure to moisture during storage and assembly.

Technical Specifications

ATM/SONET/SDH Circuits ADN2811ACP-CML-RL attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.215 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADN2811ACP-CML-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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