Loading...

LMK04133SQE/NOPB

Texas Instruments

LMK04133SQE/NOPB by Texas Instruments

LMK04133SQE/NOPB by Texas Instruments is a 48-terminal chip carrier with matte tin finish. It operates in industrial temperature range (-40 to 85°C) and supports SDH and SONET applications. With a nominal voltage of 3.3V, it features two channels for ATM/SONET/SDH circuits.

Median Price

$10.226

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,731 parts In-Stock

1+ parts

$7.362

100+ parts

$6.431

1k+ parts

$4.435

10k+ parts

-

5,731

$7.362

$6.431

$4.435

-

Mouser Electronics

USA . 994 parts In-Stock

1+ parts

$13.090

100+ parts

$8.400

1k+ parts

$6.920

10k+ parts

-

994

$13.090

$8.400

$6.920

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,171 parts In-Stock

1+ parts

$6.994

100+ parts

-

1k+ parts

-

10k+ parts

-

3,171

$6.994

-

-

-

Vyrian

USA . 2,011 parts In-Stock

1+ parts

$7.362

100+ parts

-

1k+ parts

-

10k+ parts

-

2,011

$7.362

-

-

-

Anansix

USA . 1,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,847

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,914 parts In-Stock

1+ parts

$5.027

100+ parts

-

1k+ parts

$4.826

10k+ parts

$4.826

1,914

$5.027

-

$4.826

$4.826

Corphita

USA . 1,849 parts In-Stock

1+ parts

$6.626

100+ parts

-

1k+ parts

-

10k+ parts

-

1,849

$6.626

-

-

-

Parana Technologies

USA . 1,429 parts In-Stock

1+ parts

$8.427

100+ parts

-

1k+ parts

$9.066

10k+ parts

-

1,429

$8.427

-

$9.066

-

DigiPath Technology Company

USA . 2,365 parts In-Stock

1+ parts

$9.279

100+ parts

$8.536

1k+ parts

-

10k+ parts

-

2,365

$9.279

$8.536

-

-

ChromeModa Solutions

Germany . 3,414 parts In-Stock

1+ parts

$9.468

100+ parts

$7.764

1k+ parts

-

10k+ parts

-

3,414

$9.468

$7.764

-

-

IDEA Electronic Components Group

UK . 574 parts In-Stock

1+ parts

$9.468

100+ parts

$8.995

1k+ parts

$8.521

10k+ parts

-

574

$9.468

$8.995

$8.521

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$18.465

100+ parts

$16.803

1k+ parts

$15.141

10k+ parts

-

1,000

$18.465

$16.803

$15.141

-

Overview

Elevate your telecom applications with the LMK04133SQE/NOPB by Texas Instruments. Designed for optimal performance in ATM/SONET/SDH circuits, this high-quality chip carrier offers reliability and precision. With a wide temperature range and no-lead terminal form, this industrial-grade device ensures seamless operation in SDH and SONET systems. Trust Texas Instruments for cutting-edge technology that delivers superior value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables usage in a wide range of environments.

Nominal Supply Voltage: 3.3 V

Stable supply voltage of 3.3V ensures consistent and reliable operation.

Applications: SDH; SONET

Supports SDH and SONET applications, making it a versatile and compatible choice for various networking requirements.

Technical Specifications

ATM/SONET/SDH Circuits LMK04133SQE/NOPB attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMK04133SQE/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20