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SLK2721PZP

Texas Instruments

SLK2721PZP by Texas Instruments

SLK2721PZP by Texas Instruments is an ATM/SONET/SDH transceiver with 100 terminals in a square package. Operating temperature range from -40 to 85 °C, suitable for industrial applications like SDH and SONET. Features include 2.5V supply voltage, GULL WING terminal form, and 0.5mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,079 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,079

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Digiode

USA . 748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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748

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$10.929

100+ parts

-

1k+ parts

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10k+ parts

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386

$10.929

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-

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Parana Technologies

USA . 805 parts In-Stock

1+ parts

$14.677

100+ parts

-

1k+ parts

$15.117

10k+ parts

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805

$14.677

-

$15.117

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DigiPath Technology Company

USA . 1,675 parts In-Stock

1+ parts

$16.161

100+ parts

-

1k+ parts

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10k+ parts

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1,675

$16.161

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ChromeModa Solutions

Germany . 3,305 parts In-Stock

1+ parts

$16.491

100+ parts

$13.523

1k+ parts

-

10k+ parts

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3,305

$16.491

$13.523

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IDEA Electronic Components Group

UK . 1,056 parts In-Stock

1+ parts

$16.491

100+ parts

$15.666

1k+ parts

$14.842

10k+ parts

-

1,056

$16.491

$15.666

$14.842

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One Stop Electronics

USA . 658 parts In-Stock

1+ parts

$967.000

100+ parts

-

1k+ parts

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10k+ parts

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658

$967.000

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Corphita

USA . 4,060 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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4,060

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the SLK2721PZP, a cutting-edge ATM/SONET/SDH transceiver. Designed with precision and innovation, this product offers seamless integration and top-notch performance in SDH and SONET applications. With its advanced features and durable construction, customers can trust that they are getting the best value for their investment. Elevate your telecom projects with the SLK2721PZP and enjoy the benefits of Texas Instruments' expertise in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for ATM/SONET/SDH circuits that may be used in various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the PCB and allowing for efficient layout of components.

Power Supplies (V): 2.5

Operating at 2.5V ensures compatibility with standard power supplies and helps in reducing power consumption, making it cost-effective.

No. of Terminals: 100

Having 100 terminals allows for multiple connections and enables the product to handle complex circuitry requirements in ATM/SONET/SDH applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Offering a variety of package styles provides flexibility in choosing the most suitable option based on specific design and space constraints.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions and operate reliably in demanding applications.

Minimum Operating Temperature: -40 °C

The product can function effectively in extreme cold temperatures as low as -40°C, making it suitable for use in a wide range of environments.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections, reducing the risk of signal interference and ensuring reliable performance.

Maximum Seated Height: 1.2 mm

Low maximum seated height helps in maintaining a slim profile and allows for compact integration within the circuit design.

Width: 14 mm

A width of 14mm offers compatibility with standard PCB sizes and enables easy integration into existing circuit layouts.

Length: 14 mm

A length of 14mm ensures a balanced and symmetrical design, facilitating efficient placement on the PCB and enhancing overall stability.

Temperature Grade: INDUSTRIAL

Industrial grade temperature tolerance ensures reliable performance in harsh industrial environments, making it a robust choice for critical applications.

Applications: SDH; SONET

Specifically designed for SDH and SONET applications, ensuring compatibility and optimized performance in telecommunications networks.

Terminal Form: GULL WING

Gull wing terminal form offers secure solder connections and allows for easy installation onto the PCB, ensuring reliable signal transmission.

Telecom IC Type: ATM/SONET/SDH TRANSCEIVER

Dedicated telecom IC type for ATM/SONET/SDH circuits, guaranteeing efficient data transmission and seamless communication within the network.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V ensures stable and consistent performance, supporting a wide range of power requirements in telecom applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm allows for precise and compact layout of terminals, enabling high-density connections and efficient signal routing.

Technical Specifications

ATM/SONET/SDH Circuits SLK2721PZP attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SLK2721PZP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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