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SLK2701IPZPG4

Texas Instruments

SLK2701IPZPG4 by Texas Instruments

SLK2701IPZPG4 by Texas Instruments is an ATM/SONET/SDH transceiver with 2.5V supply voltage, suitable for SDH and SONET applications. It features a plastic/epoxy package body, quad terminal position, and operates in industrial temperature range (-40 to 85°C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,597 parts In-Stock

1+ parts

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1k+ parts

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4,597

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Vyrian

USA . 4,510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,510

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 453 parts In-Stock

1+ parts

$12.895

100+ parts

-

1k+ parts

-

10k+ parts

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453

$12.895

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-

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Parana Technologies

USA . 952 parts In-Stock

1+ parts

$13.497

100+ parts

-

1k+ parts

$14.005

10k+ parts

-

952

$13.497

-

$14.005

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DigiPath Technology Company

USA . 752 parts In-Stock

1+ parts

$14.862

100+ parts

-

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752

$14.862

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ChromeModa Solutions

Germany . 6,382 parts In-Stock

1+ parts

$15.165

100+ parts

$12.435

1k+ parts

-

10k+ parts

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6,382

$15.165

$12.435

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IDEA Electronic Components Group

UK . 448 parts In-Stock

1+ parts

$15.165

100+ parts

$14.407

1k+ parts

$13.648

10k+ parts

-

448

$15.165

$14.407

$13.648

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Ampacity Inc.

Singapore . 915 parts In-Stock

1+ parts

$239.000

100+ parts

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10k+ parts

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915

$239.000

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Semicontronic

India . 1,331 parts In-Stock

1+ parts

$323.000

100+ parts

$314.925

1k+ parts

$313.310

10k+ parts

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1,331

$323.000

$314.925

$313.310

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One Stop Electronics

USA . 682 parts In-Stock

1+ parts

$971.000

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682

$971.000

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Corphita

USA . 1,498 parts In-Stock

1+ parts

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1,498

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Corohmni

South Africa . 498 parts In-Stock

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498

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Overview

Experience superior performance and reliability with the SLK2701IPZPG4 by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers cutting-edge ATM/SONET/SDH circuits that are perfect for SDH and SONET applications. With a robust package body material and surface mount capability, this product offers exceptional value and benefits to customers looking for high-quality telecom ICs. Trust in Texas Instruments to provide you with top-of-the-line solutions for all your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Power Supplies (V): 2.5

Operating at a low voltage of 2.5V reduces power consumption and heat dissipation, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperature environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures superior conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Temperature Grade: INDUSTRIAL

Being industrial-grade means the product is designed for reliable operation in harsh industrial environments, making it suitable for a wide range of applications.

Technical Specifications

ATM/SONET/SDH Circuits SLK2701IPZPG4 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SLK2701IPZPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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