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SLK2501IPZPG4

Texas Instruments

SLK2501IPZPG4 by Texas Instruments

SLK2501IPZPG4 by Texas Instruments is an ATM/SONET/SDH transceiver with 2.5V supply voltage, suitable for SDH and SONET applications. It features a flatpack package style, nickel palladium gold terminal finish, and operates in industrial temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,569 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,569

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Vyrian

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$11.555

100+ parts

-

1k+ parts

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10k+ parts

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852

$11.555

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Parana Technologies

USA . 757 parts In-Stock

1+ parts

$15.506

100+ parts

-

1k+ parts

$15.881

10k+ parts

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757

$15.506

-

$15.881

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DigiPath Technology Company

USA . 1,368 parts In-Stock

1+ parts

$17.074

100+ parts

$15.708

1k+ parts

-

10k+ parts

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1,368

$17.074

$15.708

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ChromeModa Solutions

Germany . 6,341 parts In-Stock

1+ parts

$17.422

100+ parts

$14.286

1k+ parts

-

10k+ parts

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6,341

$17.422

$14.286

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IDEA Electronic Components Group

UK . 1,000 parts In-Stock

1+ parts

$17.422

100+ parts

$16.551

1k+ parts

$15.680

10k+ parts

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1,000

$17.422

$16.551

$15.680

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One Stop Electronics

USA . 1,054 parts In-Stock

1+ parts

$422.000

100+ parts

-

1k+ parts

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10k+ parts

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1,054

$422.000

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Corphita

USA . 1,982 parts In-Stock

1+ parts

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1,982

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Microchip USA

USA . 301 parts In-Stock

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100+ parts

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301

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Overview

Experience the unparalleled reliability and performance of Texas Instruments with the SLK2501IPZPG4. Designed for ATM/SONET/SDH circuits, this innovative product offers a wide range of applications in the telecom industry. With a package body made of high-quality materials and advanced technology, customers can trust in the durability and efficiency of this transceiver. Benefit from its compact design, low power consumption, and seamless integration into various systems. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort.

Package Shape: SQUARE

The square shape of the package provides efficient use of space on the circuit board.

Power Supplies (V): 2.5

Operating at a low voltage of 2.5V helps in reducing power consumption.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for the circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stability and reliability under varying environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively even in harsh cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances the durability and conductivity of the terminals.

Terminal Position: QUAD

The quad terminal position enables a secure and stable connection on the circuit board.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps in achieving a compact design for the product.

Width: 14 mm

The width of 14mm offers flexibility for placement on the circuit board while ensuring efficient use of space.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures a reliable soldering process during manufacturing.

Peak Reflow Temperature °C: 260

Operating at a high peak reflow temperature of 260°C ensures a secure and stable solder joint.

Length: 14 mm

The length of 14mm complements the square shape of the package, contributing to space efficiency.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures the product's performance and reliability in demanding industrial environments.

Applications: SDH; SONET

Designed for SDH and SONET applications, making it a suitable choice for telecommunications networks.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and easy soldering during assembly.

Telecom IC Type: ATM/SONET/SDH TRANSCEIVER

With the telecom IC type of ATM/SONET/SDH transceiver, the product offers reliable and efficient communication capabilities.

Nominal Supply Voltage: 2.5 V

Operating at the nominal supply voltage of 2.5V ensures consistent and stable performance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and efficient use of space on the circuit board.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

ATM/SONET/SDH Circuits SLK2501IPZPG4 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SLK2501IPZPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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