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SLK2511CPZP

Texas Instruments

SLK2511CPZP by Texas Instruments

SLK2511CPZP by Texas Instruments is an ATM/SONET/SDH transceiver IC with 100 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 2.5V and peak reflow temperature of 260°C. Ideal for industrial telecom applications requiring high-speed data transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,409 parts In-Stock

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3,409

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Digiode

USA . 914 parts In-Stock

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914

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,052 parts In-Stock

1+ parts

$11.230

100+ parts

-

1k+ parts

$11.666

10k+ parts

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2,052

$11.230

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$11.666

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DigiPath Technology Company

USA . 1,357 parts In-Stock

1+ parts

$12.366

100+ parts

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1,357

$12.366

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IDEA Electronic Components Group

UK . 1,862 parts In-Stock

1+ parts

$12.618

100+ parts

$11.987

1k+ parts

$11.356

10k+ parts

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1,862

$12.618

$11.987

$11.356

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ChromeModa Solutions

Germany . 1,219 parts In-Stock

1+ parts

$12.618

100+ parts

$10.347

1k+ parts

-

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1,219

$12.618

$10.347

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AZTECH Wire

Italy . 335 parts In-Stock

1+ parts

$17.176

100+ parts

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335

$17.176

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Component Stockers USA

USA . 326 parts In-Stock

1+ parts

$99.990

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326

$99.990

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Ampacity Inc.

Singapore . 624 parts In-Stock

1+ parts

$342.000

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624

$342.000

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One Stop Electronics

USA . 1,001 parts In-Stock

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$634.000

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1,001

$634.000

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Semicontronic

India . 515 parts In-Stock

1+ parts

$643.000

100+ parts

$626.925

1k+ parts

$623.710

10k+ parts

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515

$643.000

$626.925

$623.710

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Lixinc

USA . 19,511 parts In-Stock

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19,511

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QUARKTWIN TECHNOLOGY LTD

USA . 5,729 parts In-Stock

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5,729

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 2,732 parts In-Stock

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2,732

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Metaverse IC Inc.

Canada . 866 parts In-Stock

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866

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Corohmni

South Africa . 271 parts In-Stock

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271

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Microchip USA

USA . 227 parts In-Stock

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227

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Overview

Unlock the power of seamless communication with the SLK2511CPZP by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This ATM/SONET/SDH Circuits IC offers a wide range of applications, providing unparalleled performance and efficiency. With its compact design and advanced features, this product ensures optimal functionality in various telecom systems. Experience the value and benefits of cutting-edge technology with the SLK2511CPZP, your ultimate solution for all communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body ensures long-lasting performance and easy handling of the product.

Surface Mount: YES

Ease of installation and integration with other components on a circuit board.

No. of Terminals: 100

Sufficient number of terminals for connectivity and functionality in ATM/SONET/SDH circuits.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the product to function effectively in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for enhanced electrical conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position facilitates secure and stable connections in the circuit.

Width: 14 mm

Compact width of the product for efficient use of space on a circuit board.

Nominal Supply Voltage: 2.5 V

Ideal supply voltage for reliable performance of the ATM/SONET/SDH transceiver.

Technical Specifications

ATM/SONET/SDH Circuits SLK2511CPZP attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SLK2511CPZP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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