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ADN2809XCP

Analog Devices

ADN2809XCP by Analog Devices

ADN2809XCP by Analog Devices is an ATM/SONET/SDH circuit in a square chip carrier package. It operates at 3.3V with 48 terminals and a max supply current of 0.38mA. Ideal for SDH and SONET applications, it has a temperature range of -40 to 85 °C and terminal finish of Tin Lead.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,866 parts In-Stock

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Digiode

USA . 2 parts In-Stock

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AZTECH Wire

Italy . 270 parts In-Stock

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$13.365

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270

$13.365

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Parana Technologies

USA . 1,141 parts In-Stock

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$13.532

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$12.584

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1,141

$13.532

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$12.584

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IDEA Electronic Components Group

UK . 735 parts In-Stock

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$14.550

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$13.822

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$13.822

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735

$14.550

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$13.822

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DigiPath Technology Company

USA . 13 parts In-Stock

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$22.698

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$21.790

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$21.790

13

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$21.790

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$21.790

Native Components

USA . 401 parts In-Stock

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$37.468

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$35.969

401

$37.468

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$35.969

Northwest PG Solutions

USA . 535 parts In-Stock

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$41.215

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535

$41.215

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Semicontronic

India . 197 parts In-Stock

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$98.000

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$95.550

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$95.060

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One Stop Electronics

USA . 492 parts In-Stock

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$753.000

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Ampacity Inc.

Singapore . 441 parts In-Stock

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$778.000

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Corphita

USA . 544 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the ADN2809XCP by Analog Devices. Manufactured with precision and expertise, this ATM/SONET/SDH circuit offers unparalleled reliability and performance. Ideal for SDH and SONET applications, this chip carrier boasts a very thin profile and industrial-grade temperature resilience. With a nominal supply voltage of 3.3V and low supply current, customers can trust in the efficiency and value that this telecom IC type clock recovery circuit brings to their projects. Elevate your networking solutions with the ADN2809XCP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the circuit, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3

Operates at a commonly used voltage level, making it compatible with a wide range of systems and equipment.

No. of Terminals: 48

Offers a sufficient number of terminals for connectivity and integration within complex network setups.

Applications: SDH; SONET

Designed specifically for use in SDH and SONET systems, ensuring optimal performance and compatibility.

Technical Specifications

ATM/SONET/SDH Circuits ADN2809XCP attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e0

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.38 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADN2809XCP Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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