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LE88276DLCT

Microchip Technology

LE88276DLCT by Microchip Technology

LE88276DLCT by Microchip Technology is an ATM/SONET/SDH circuit with 80 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This CMOS technology IC has a nominal voltage of 3.3V, ideal for telecom network interfaces.

Median Price

$16.190

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$16.190

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85

$16.190

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Cyclops Electronics Ltd

UK . 30,000 parts In-Stock

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30,000

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Chip Stock

USA . 21,690 parts In-Stock

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21,690

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Vyrian

USA . 456 parts In-Stock

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456

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$5.875

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559

$5.875

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Continental Prestige Electronics

USA . 5,839 parts In-Stock

1+ parts

$16.190

100+ parts

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1k+ parts

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10k+ parts

$15.866

5,839

$16.190

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$15.866

Netroflash

USA . 100 parts In-Stock

1+ parts

$16.190

100+ parts

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100

$16.190

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Alle Elektronik GmbH

Germany . 4,166 parts In-Stock

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4,166

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Argo Parts USA

USA . 3,872 parts In-Stock

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3,872

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West Coast Incorporated

USA . 2,522 parts In-Stock

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2,522

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unleash the power of reliable networking with the LE88276DLCT by Microchip Technology. Known for their top-notch quality and innovative solutions, Microchip Technology presents this cutting-edge ATM/SONET/SDH Circuit that promises seamless connectivity and superior performance. Perfect for a wide range of applications, this product boasts a modern design with a heat sink/slug package style, ensuring optimal functionality in industrial settings. Say goodbye to connectivity issues and hello to efficiency with the LE88276DLCT. Elevate your network experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product sturdy and easy to handle.

Surface Mount: YES

Allows for easy installation and integration into existing systems.

No. of Terminals: 80

Offers a high level of connectivity and compatibility with various devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, ensuring reliable performance.

Technology: CMOS

Utilizes advanced CMOS technology for efficient power consumption and high-speed processing.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage level, making it compatible with common power sources.

Technical Specifications

ATM/SONET/SDH Circuits LE88276DLCT attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.6SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LE88276DLCT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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