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LE88311DLC

Zarlink Semiconductor

LE88311DLC by Zarlink Semiconductor

ATM/SONET/SDH NETWORK INTERFACE; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: HLQFP; Package Shape: SQUARE;

Median Price

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Lifecycle Status

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Technical Specifications

ATM/SONET/SDH Circuits LE88311DLC attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Zarlink Semiconductor

Specs

Applications:

ATM

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LE88311DLC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Zarlink Semiconductor

Zarlink Semiconductor - Microsemi Company Overview Zarlink Semiconductor was acquired by Microsemi as of October 2011. Microsemi Corporation offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Zarlink Semiconductor - Microsemi Products The types of products manufactured by Zarlink Semiconductor - Microsemi include Analog Switches, Medical Surge Protection ICs, Laser Diode Drivers (LDD), Analog Amplifiers, Telephony ICs, Packet Processing ICs, Packet Switching ICs, Timing and Synchronization (DS1/E1, SONET/SDH) ICs, TDM/TSI Switches, ATM (Asynchronous Transfer Mode) ICs, Voice Processing ICs, Optoelectronic Products, Frequency Synthesis Products, Wireless Data Products, Ultra-low Power Communication Products, Baseband Signal Processing Products, and Cellular Telephony Products.

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