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LE88276DLC

Microchip Technology

LE88276DLC by Microchip Technology

LE88276DLC by Microchip Technology is an ATM/SONET/SDH circuit with 80 terminals, CMOS technology, and a 3.3V supply voltage. It is used in telecom applications for network interfaces due to its industrial temperature grade range of -40 to 85°C and GULL WING terminal form. The package style is a flatpack with a square shape measuring 14mm x 14mm, making it suitable for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 6,673 parts In-Stock

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6,673

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Electronics Depot

USA . 424 parts In-Stock

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424

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Vectronix, Inc

USA . 200 parts In-Stock

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200

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Nova Conductors

Japan . 82 parts In-Stock

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82

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Distributors (Availability)

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XL Components Corporation

Australia . 5,377 parts In-Stock

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5,377

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QUARKTWIN TECHNOLOGY LTD

USA . 4,355 parts In-Stock

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4,355

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QualityLine Systems

Poland . 3,973 parts In-Stock

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3,973

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Marpe Global Electronics

Taiwan . 2,954 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Alle Elektronik GmbH

Germany . 1,519 parts In-Stock

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Metaverse IC Inc.

Canada . 552 parts In-Stock

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552

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Microchip USA

USA . 492 parts In-Stock

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492

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Kepictronics

USA . 452 parts In-Stock

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452

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Overview

Unlock the power of advanced telecommunications with the LE88276DLC by Microchip Technology. This cutting-edge ATM/SONET/SDH circuit offers unparalleled quality and reliability, reflecting the manufacturer's commitment to excellence. Ideal for a wide range of applications, this product provides customers with value, benefits, and advantages that set it apart from the competition. Experience seamless connectivity and superior performance with the LE88276DLC - the ultimate choice for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, this product is lightweight and durable, making it easy to handle and resistant to damage.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the circuit board, allowing for a compact design.

No. of Terminals: 80

With 80 terminals, this product offers a high level of connectivity options, making it versatile for various networking applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability and performance in challenging environments.

Technology: CMOS

The CMOS technology used in this product provides low power consumption and high-speed performance, making it energy-efficient.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this product is compatible with standard power sources, ensuring easy integration into existing systems.

Technical Specifications

ATM/SONET/SDH Circuits LE88276DLC attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.6SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LE88276DLC Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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