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ONET8521TY

Texas Instruments

ONET8521TY by Texas Instruments

ONET8521TY by Texas Instruments is a telecom IC for SONET applications. It operates at 3.3V with max supply current of 40mA. With industrial temperature grade, it supports ATM/SONET/SDH circuits in a surface mount rectangular package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,524 parts In-Stock

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4,524

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Digiode

USA . 4,308 parts In-Stock

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4,308

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,303 parts In-Stock

1+ parts

$5.537

100+ parts

-

1k+ parts

$6.301

10k+ parts

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1,303

$5.537

-

$6.301

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ChromeModa Solutions

Germany . 6,372 parts In-Stock

1+ parts

$6.221

100+ parts

$5.101

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6,372

$6.221

$5.101

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IDEA Electronic Components Group

UK . 2,139 parts In-Stock

1+ parts

$6.221

100+ parts

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$5.599

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2,139

$6.221

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$5.599

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Microchip USA

USA . 2,785 parts In-Stock

1+ parts

$16.980

100+ parts

$16.880

1k+ parts

$16.830

10k+ parts

$16.780

2,785

$16.980

$16.880

$16.830

$16.780

AZTECH Wire

Italy . 635 parts In-Stock

1+ parts

$17.108

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635

$17.108

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One Stop Electronics

USA . 1,458 parts In-Stock

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$589.000

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1,458

$589.000

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Corphita

USA . 4,545 parts In-Stock

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4,545

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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Lixinc

USA . 1,743 parts In-Stock

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1,743

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DigiPath Technology Company

USA . 516 parts In-Stock

1+ parts

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100+ parts

$5.609

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516

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$5.609

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Overview

Elevate your SONET applications with the ONET8521TY by Texas Instruments. This cutting-edge ATM/SONET/SDH circuit boasts unparalleled quality and reliability, thanks to its manufacturer's reputation for excellence. With surface mount capabilities and a wide temperature range, this telecom IC is versatile and robust. Experience seamless performance and enhanced efficiency with the ONET8521TY, providing exceptional value and benefits for all your networking needs. Trust Texas Instruments to deliver top-of-the-line solutions for your critical communication systems.

Feature Benefit Bullets

Surface Mount YES

Allows for easy and efficient mounting onto circuit boards, saving space and improving overall functionality.

Package Shape RECTANGULAR

Rectangular shape provides compatibility with standard packaging and allows for easy integration into existing systems.

Power Supplies (V) 3.3

Operates at a standard voltage of 3.3V, ensuring compatibility with various power sources and reducing the need for additional components.

No. of Terminals 18

Provides a sufficient number of terminals for connecting to other components, allowing for versatile connectivity options.

Package Style (Meter) UNCASED CHIP

The uncased chip design offers flexibility in terms of packaging and allows for customization based on specific project requirements.

Maximum Operating Temperature 100 °C

Can operate at high temperatures up to 100°C, making it suitable for industrial applications where heat resistance is important.

Minimum Operating Temperature -40 °C

Capable of functioning in low temperatures down to -40°C, ensuring reliability in a wide range of operating conditions.

Terminal Position UPPER

Upper terminal position enables easy access for connection and maintenance, simplifying the installation process.

Width 0.87 mm

Compact width of 0.87mm allows for a space-saving design, ideal for applications where size constraints are a concern.

Length 1.036 mm

Short length of 1.036mm contributes to the overall compactness of the product, making it suitable for small-scale applications.

Temperature Grade INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and performance in harsh operating environments typically found in industrial settings.

Applications SONET

Specifically designed for SONET applications, ensuring compatibility and optimized performance in telecommunications networks.

Terminal Form NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of hazardous substances in the product.

Maximum Supply Current 40 mA

Efficiently operates at a maximum supply current of 40 mA, promoting energy efficiency and minimizing power consumption.

Telecom IC Type ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed to support ATM, SONET, and SDH circuits, offering versatility and compatibility with a wide range of telecom applications.

Nominal Supply Voltage 3.3 V

Nominal supply voltage of 3.3V ensures stable and consistent power delivery, enhancing the overall performance of the product.

Technical Specifications

ATM/SONET/SDH Circuits ONET8521TY attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Additional Features:

Data rate is 11.3 Gbps

Applications:

SONET

JESD-30 Code:

R-XUUC-N18

Length:

1.036 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.87 mm

Trade Compliance

ONET8521TY Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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