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ADN2807ACP-RL

Analog Devices

ADN2807ACP-RL by Analog Devices

ADN2807ACP-RL by Analog Devices is a 48-terminal ATM/SONET/SDH circuit with a 3.3V supply, suitable for SDH and SONET applications. It operates in industrial temperature range (-40 to 85 °C) with low current draw (0.215 mA). The chip carrier package has a square shape, measures 7x7mm, and features tin lead terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,010 parts In-Stock

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Digiode

USA . 995 parts In-Stock

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995

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AZTECH Wire

Italy . 819 parts In-Stock

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$10.629

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819

$10.629

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Parana Technologies

USA . 2,114 parts In-Stock

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$13.730

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$12.769

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$13.730

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IDEA Electronic Components Group

UK . 1,071 parts In-Stock

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$14.763

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$14.025

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$14.025

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$14.763

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DigiPath Technology Company

USA . 2,825 parts In-Stock

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$23.030

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$22.109

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$22.109

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$22.109

Semicontronic

India . 1,592 parts In-Stock

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$363.000

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$353.925

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$352.110

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1,592

$363.000

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$352.110

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One Stop Electronics

USA . 240 parts In-Stock

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$601.000

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Northwest PG Solutions

USA . 1,247 parts In-Stock

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Corphita

USA . 537 parts In-Stock

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Native Components

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Overview

Elevate your telecommunications systems with the ADN2807ACP-RL by Analog Devices, a cutting-edge ATM/SONET/SDH clock recovery circuit designed to meet the highest industry standards. With a focus on quality and precision, Analog Devices delivers reliable solutions that ensure optimal performance in SDH and SONET applications. This surface-mount device boasts a compact square package shape with 48 terminals, making it the perfect choice for space-constrained environments. Experience the value of enhanced efficiency and seamless connectivity with the ADN2807ACP-RL, setting a new benchmark for telecom ICs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Provides a standardized shape for efficient placement and alignment on the circuit board.

Power Supplies (V): 3.3

Operates at a common and reliable voltage, ensuring compatibility with other components in the system.

No. of Terminals: 48

Offers a sufficient number of connections for handling complex circuit configurations and data transfer.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combines multiple packaging features to enhance performance, thermal dissipation, and space-saving design.

Maximum Operating Temperature: 85 °C

Ensures operation in a wide range of environmental conditions, making the product suitable for various applications.

Minimum Operating Temperature: -40 °C

Capable of functioning even in extreme cold temperatures, providing reliability in harsh environments.

Terminal Finish: TIN LEAD

Improves solderability and conductivity, ensuring secure connections to the circuit board.

Terminal Position: QUAD

Facilitates efficient routing of signals and power between the components, enhancing overall performance.

Maximum Seated Height: 1 mm

Maintains a low-profile design, enabling compact and space-efficient integration within the system.

Width: 7 mm

Compact width dimension allows for flexible placement on the circuit board without sacrificing performance.

Peak Reflow Temperature °C: 240

Can withstand high-temperature reflow soldering processes, ensuring reliable and durable connections during assembly.

Length: 7 mm

Compact length dimension contributes to space-saving design and efficient utilization of board space.

Temperature Grade: INDUSTRIAL

Meets industrial-grade standards for temperature range and performance, suitable for demanding applications in various industries.

Applications: SDH; SONET

Specifically designed for SDH and SONET applications, providing optimized functionality and compatibility within these systems.

Terminal Form: NO LEAD

Eliminates the use of lead components, promoting environmental sustainability and compliance with regulations.

Maximum Supply Current: 0.215 mA

Operates at low power consumption, reducing energy costs and heat dissipation in the system.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

Specifically designed for clock recovery in ATM, SONET, and SDH systems, ensuring accurate synchronization and signal integrity.

Nominal Supply Voltage: 3.3 V

Maintains stable voltage supply for reliable operation and compatibility with other components in the system.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and efficient signal routing, enhancing overall performance.

Moisture Sensitivity Level (MSL): 3

Withstands moderate levels of moisture exposure, ensuring product reliability even in humid environments.

Technical Specifications

ATM/SONET/SDH Circuits ADN2807ACP-RL attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.215 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADN2807ACP-RL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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