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LMK04131SQ

Texas Instruments

LMK04131SQ by Texas Instruments

LMK04131SQ by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. It operates b/w -40°C to 85°C, with a nominal voltage of 3.3V. Ideal for industrial telecom applications requiring very thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,307 parts In-Stock

1+ parts

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8,307

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Digiode

USA . 997 parts In-Stock

1+ parts

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997

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Anansix

USA . 826 parts In-Stock

1+ parts

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826

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 387 parts In-Stock

1+ parts

$10.034

100+ parts

-

1k+ parts

$10.591

10k+ parts

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387

$10.034

-

$10.591

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DigiPath Technology Company

USA . 1,168 parts In-Stock

1+ parts

$11.049

100+ parts

$10.165

1k+ parts

-

10k+ parts

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1,168

$11.049

$10.165

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ChromeModa Solutions

Germany . 1,715 parts In-Stock

1+ parts

$11.274

100+ parts

$9.245

1k+ parts

-

10k+ parts

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1,715

$11.274

$9.245

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IDEA Electronic Components Group

UK . 844 parts In-Stock

1+ parts

$11.274

100+ parts

$10.710

1k+ parts

$10.147

10k+ parts

-

844

$11.274

$10.710

$10.147

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AZTECH Wire

Italy . 314 parts In-Stock

1+ parts

$13.549

100+ parts

-

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314

$13.549

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One Stop Electronics

USA . 1,347 parts In-Stock

1+ parts

$394.000

100+ parts

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1,347

$394.000

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Corphita

USA . 4,400 parts In-Stock

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4,400

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Overview

Unlock the potential of your networking applications with the LMK04131SQ by Texas Instruments. This cutting-edge ATM/SONET/SDH support circuit boasts unmatched quality and reliability, backed by the trusted reputation of its manufacturer. From its sleek square package shape to its industrial temperature grade, this product offers a seamless integration into various telecom systems. Experience the value of high-performance technology with the LMK04131SQ, providing customers with superior benefits and advantages for their critical communication needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape helps in optimizing space on the PCB and ensures efficient use of available area.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and integration with a variety of other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design ensures efficient heat dissipation and compact size, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions and maintain performance under heat stress.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for reliable operation in both extreme hot and cold environments.

Terminal Position: QUAD

Quad terminal position enables secure connections and optimal signal transmission, contributing to overall performance.

Maximum Seated Height: 0.8 mm

The low maximum seated height ensures a streamlined and compact design, making it suitable for applications where space is limited.

Width: 7 mm

The 7mm width provides a balance between size and ease of handling during installation and maintenance.

Length: 7 mm

The 7mm length contributes to the overall compactness of the product, fitting well within tight spaces on a PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Terminal Form: NO LEAD

No-lead terminal form reduces the risk of solder joint fatigue, enhancing the long-term reliability of the product.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed for ATM/SONET/SDH applications, this circuit ensures compatibility and optimized performance in telecom networks.

Nominal Supply Voltage: 3.3 V

Operating at a 3.3V supply voltage provides compatibility with standard voltage levels in many electronic systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch facilitates high-density integration on PCBs, enabling efficient signal routing and connection.

Technical Specifications

ATM/SONET/SDH Circuits LMK04131SQ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04131SQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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