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LMK04131SQE

Texas Instruments

LMK04131SQE by Texas Instruments

LMK04131SQE by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating temperature range from -40 to 85°C, with a nominal voltage of 3.3V. Ideal for industrial telecom applications requiring very thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,067 parts In-Stock

1+ parts

-

100+ parts

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4,067

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Anansix

USA . 1,719 parts In-Stock

1+ parts

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1k+ parts

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1,719

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Digiode

USA . 529 parts In-Stock

1+ parts

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10k+ parts

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529

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,199 parts In-Stock

1+ parts

$12.165

100+ parts

-

1k+ parts

$12.579

10k+ parts

-

2,199

$12.165

-

$12.579

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DigiPath Technology Company

USA . 555 parts In-Stock

1+ parts

$13.396

100+ parts

-

1k+ parts

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10k+ parts

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555

$13.396

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ChromeModa Solutions

Germany . 5,444 parts In-Stock

1+ parts

$13.669

100+ parts

$11.209

1k+ parts

-

10k+ parts

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5,444

$13.669

$11.209

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IDEA Electronic Components Group

UK . 1,159 parts In-Stock

1+ parts

$13.669

100+ parts

$12.986

1k+ parts

$12.302

10k+ parts

-

1,159

$13.669

$12.986

$12.302

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AZTECH Wire

Italy . 225 parts In-Stock

1+ parts

$16.476

100+ parts

-

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225

$16.476

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One Stop Electronics

USA . 190 parts In-Stock

1+ parts

$352.000

100+ parts

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190

$352.000

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Corphita

USA . 4,106 parts In-Stock

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4,106

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Overview

Unlock the potential of your telecom systems with the LMK04131SQE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality ATM/SONET/SDH Circuits that are reliable and efficient. This versatile product offers a wide range of applications, ensuring seamless integration into your projects. With its surface mount design and compact package shape, this chip carrier provides convenience without sacrificing performance. Trust in Texas Instruments to provide exceptional value and benefits for all your telecom needs. Elevate your systems with the LMK04131SQE today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing manufacturing costs and increasing reliability.

Package Shape: SQUARE

The square package shape allows for easier handling and placement on the PCB, ensuring proper alignment and reducing the risk of errors during assembly.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options, allowing for versatile circuit designs and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation, optimal performance, and compact size, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable operation in various settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold environments without compromising performance or reliability.

Terminal Position: QUAD

Quad terminal positions facilitate easy and secure connections, enhancing the overall reliability and stability of the circuit.

Maximum Seated Height: 0.8 mm

The low maximum seated height enables a compact and slim design, ideal for space-saving applications and increased PCB density.

Width: 7 mm

The narrow width allows for efficient use of space on the PCB, enabling the integration of additional components and features in a limited area.

Length: 7 mm

The small length contributes to the overall compactness of the product, making it suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding industrial environments, offering long-term performance and durability.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of solder joints cracking or breaking, enhancing the product's durability and long-term reliability.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed as a support circuit for ATM/SONET/SDH applications, ensuring compatibility and optimal performance in telecom systems and networks.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is common in telecom and networking applications, providing compatibility and consistent power for reliable operation.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting, enabling efficient use of PCB space and the integration of multiple components for enhanced functionality.

Technical Specifications

ATM/SONET/SDH Circuits LMK04131SQE attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04131SQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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