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LMK04110SQ/NOPB

Texas Instruments

LMK04110SQ/NOPB by Texas Instruments

LMK04110SQ/NOPB by Texas Instruments is a 48-terminal chip carrier with matte tin finish. It operates b/w -40 to 85°C, ideal for industrial applications like SDH and SONET. With a nominal voltage of 3.3V, it supports ATM/SONET/SDH circuits in telecom systems.

Median Price

$10.518

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,750 parts In-Stock

1+ parts

$10.518

100+ parts

$9.187

1k+ parts

$6.336

10k+ parts

-

16,750

$10.518

$9.187

$6.336

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,806 parts In-Stock

1+ parts

$9.992

100+ parts

-

1k+ parts

-

10k+ parts

-

2,806

$9.992

-

-

-

Vyrian

USA . 2,167 parts In-Stock

1+ parts

$10.518

100+ parts

-

1k+ parts

-

10k+ parts

-

2,167

$10.518

-

-

-

Anansix

USA . 1,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,872

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 5,074 parts In-Stock

1+ parts

$9.466

100+ parts

-

1k+ parts

-

10k+ parts

-

5,074

$9.466

-

-

-

Andel Nordic

Denmark . 3,892 parts In-Stock

1+ parts

$10.507

100+ parts

-

1k+ parts

$10.087

10k+ parts

$10.087

3,892

$10.507

-

$10.087

$10.087

Parana Technologies

USA . 594 parts In-Stock

1+ parts

$15.037

100+ parts

-

1k+ parts

$15.451

10k+ parts

-

594

$15.037

-

$15.451

-

DigiPath Technology Company

USA . 490 parts In-Stock

1+ parts

$16.557

100+ parts

$15.233

1k+ parts

-

10k+ parts

-

490

$16.557

$15.233

-

-

IDEA Electronic Components Group

UK . 1,419 parts In-Stock

1+ parts

$16.895

100+ parts

$16.050

1k+ parts

$15.206

10k+ parts

-

1,419

$16.895

$16.050

$15.206

-

ChromeModa Solutions

Germany . 1,141 parts In-Stock

1+ parts

$16.895

100+ parts

$13.854

1k+ parts

-

10k+ parts

-

1,141

$16.895

$13.854

-

-

Overview

Unlock the potential of your SDH and SONET applications with the LMK04110SQ/NOPB by Texas Instruments. This cutting-edge ATM/SONET/SDH circuit offers unmatched quality and reliability, thanks to its prestigious manufacturer. With a temperature grade of industrial and a nominal supply voltage of 3.3V, this chip carrier delivers exceptional performance in even the harshest conditions. Say goodbye to lead terminal issues with the innovative no-lead terminal form. Upgrade your telecom systems with ease, knowing that the LMK04110SQ/NOPB provides the value, benefits, and advantages you need to stay ahead of the game.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good mechanical strength and thermal conductivity, making the product durable and reliable for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures that the product can withstand harsh environmental conditions without performance degradation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is commonly used in many electronic devices, making this product compatible with a wide range of applications.

Applications: SDH; SONET

The product is specifically designed to support SDH and SONET applications, ensuring high performance and reliability in telecom networks.

Technical Specifications

ATM/SONET/SDH Circuits LMK04110SQ/NOPB attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMK04110SQ/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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