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OMAPL137BZKBA3

Texas Instruments

OMAPL137BZKBA3 by Texas Instruments

OMAPL137BZKBA3 by Texas Instruments is a DSP with 16-bit external data bus, 375 MHz clock frequency, and 13-bit address bus width. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 105°C and boundary scan capability.

Median Price

$22.170

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

$22.170

100+ parts

$21.730

1k+ parts

$21.280

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4

$22.170

$21.730

$21.280

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Distributors (In-Stock)

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Component Electronics Inc.

Canada . 4 parts In-Stock

1+ parts

$23.080

100+ parts

$17.310

1k+ parts

$15.000

10k+ parts

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4

$23.080

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$15.000

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Vyrian

USA . 5,231 parts In-Stock

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Digiode

USA . 3,474 parts In-Stock

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A&K Electronics

USA . 60 parts In-Stock

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Bristol Electronics

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60

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ComSIT Distribution GmbH

Germany . 35 parts In-Stock

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Goldney Electronics S.L.

Spain . 30 parts In-Stock

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Inventory MP

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Distributors (Availability)

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One Stop Electronics

USA . 757 parts In-Stock

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$9.000

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757

$9.000

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AZTECH Wire

Italy . 437 parts In-Stock

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$9.904

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Parana Technologies

USA . 1,408 parts In-Stock

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$39.690

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ChromeModa Solutions

Germany . 5,836 parts In-Stock

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$44.595

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$36.568

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$44.595

$36.568

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IDEA Electronic Components Group

UK . 2,362 parts In-Stock

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$44.595

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$42.365

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$40.136

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2,362

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$42.365

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Corohmni

South Africa . 4,933 parts In-Stock

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$46.201

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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DigiPath Technology Company

USA . 1,554 parts In-Stock

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$40.207

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Corphita

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Microchip USA

USA . 309 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the OMAPL137BZKBA3 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unmatched quality and reliability. Ideal for a wide range of applications, this DSP offers exceptional performance and value. Experience seamless processing at lightning speeds with this versatile product. Elevate your projects to the next level with the OMAPL137BZKBA3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is common for electronic components as it is lightweight, durable, and cost-effective.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making the product suitable for applications where space is limited.

Maximum Supply Voltage: 1.32 V

Operating within this voltage range ensures efficient and safe performance of the DSP.

Address Bus Width: 13

A wider address bus allows for more memory addressing capabilities, enhancing the processing capabilities of the DSP.

Package Shape: SQUARE

The square shape of the package makes it easier to place and secure on circuit boards, improving reliability.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this DSP suitable for industrial applications where high temperatures may be encountered.

Maximum Clock Frequency: 375 MHz

The high clock frequency allows for fast processing speeds, making the DSP ideal for applications requiring real-time signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in noisy environments.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137BZKBA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

375 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

OMAPL137BZKBA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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