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MSP430F6778IPEU

Texas Instruments

MSP430F6778IPEU by Texas Instruments

MSP430F6778IPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at up to 25 MHz. Ideal for industrial applications, it features ROM of 524288 words, RAM of 16 words, and supports I2C, SPI, and UART bus compatibility.

Median Price

$11.864

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,430 parts In-Stock

1+ parts

$11.864

100+ parts

$10.363

1k+ parts

$7.147

10k+ parts

-

2,430

$11.864

$10.363

$7.147

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,055 parts In-Stock

1+ parts

$11.271

100+ parts

-

1k+ parts

-

10k+ parts

-

1,055

$11.271

-

-

-

Vyrian

USA . 3,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,503

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,054 parts In-Stock

1+ parts

$10.080

100+ parts

-

1k+ parts

-

10k+ parts

-

2,054

$10.080

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-

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Corphita

USA . 4,069 parts In-Stock

1+ parts

$10.678

100+ parts

-

1k+ parts

-

10k+ parts

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4,069

$10.678

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-

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Corohmni

South Africa . 707 parts In-Stock

1+ parts

$12.785

100+ parts

-

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10k+ parts

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707

$12.785

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AZTECH Wire

Italy . 679 parts In-Stock

1+ parts

$14.560

100+ parts

-

1k+ parts

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10k+ parts

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679

$14.560

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-

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Microchip USA

USA . 2,100 parts In-Stock

1+ parts

$37.390

100+ parts

$36.860

1k+ parts

$36.590

10k+ parts

$36.320

2,100

$37.390

$36.860

$36.590

$36.320

Parana Technologies

USA . 1,789 parts In-Stock

1+ parts

$67.584

100+ parts

-

1k+ parts

-

10k+ parts

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1,789

$67.584

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DigiPath Technology Company

USA . 536 parts In-Stock

1+ parts

$74.418

100+ parts

$68.465

1k+ parts

-

10k+ parts

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536

$74.418

$68.465

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IDEA Electronic Components Group

UK . 1,533 parts In-Stock

1+ parts

$75.937

100+ parts

$72.140

1k+ parts

$68.343

10k+ parts

-

1,533

$75.937

$72.140

$68.343

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ChromeModa Solutions

Germany . 247 parts In-Stock

1+ parts

$75.937

100+ parts

$62.268

1k+ parts

-

10k+ parts

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247

$75.937

$62.268

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Overview

Unlock the power of cutting-edge technology with the MSP430F6778IPEU by Texas Instruments, a versatile microprocessor circuit designed to exceed your expectations. With its high-quality construction and advanced features, this product is perfect for a wide range of applications. Experience seamless performance and reliability with the MSP430 family CPU, offering unparalleled value and benefits to customers. Whether you're in industrial automation, consumer electronics, or IoT development, this innovative solution will elevate your projects to new heights. Trust Texas Instruments for superior quality and unleash the full potential of your designs with the MSP430F6778IPEU.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the components inside, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy installation and integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power requirements and compatibility with different power sources.

Package Shape: RECTANGULAR

The rectangular shape provides a standard form factor for easy placement and mounting within electronic devices.

Bit Size: 16

The 16-bit architecture enables efficient processing and performance for a variety of applications.

Power Supplies (V): 2/3.3

Support for multiple power supply options allows for versatile use in different power configurations.

No. of Terminals: 128

Having a high number of terminals enables connectivity to multiple external devices and peripherals for enhanced functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack style with low profile and fine pitch design allows for compact and space-efficient integration on circuit boards.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption and compatibility with lower voltage systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial applications and harsh environments.

CPU Family: MSP430

The MSP430 CPU family offers efficient processing capabilities and performance for embedded system designs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in cold environments or during temperature fluctuations.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

The inclusion of ADC channels enables analog-to-digital conversion for accurate sensor data processing and measurement.

Terminal Position: QUAD

The quad terminal position offers secure and stable connections for reliable signal transmission and communication.

ROM Words: 524288

The large ROM capacity allows for storing a significant amount of program data and firmware for diverse application requirements.

Maximum Seated Height: 1.6 mm

The low seated height makes the product suitable for compact device designs with limited vertical space.

RAM Words: 16

Although low, the RAM capacity is sufficient for temporary data storage and processing tasks in embedded systems.

Width: 14 mm

The compact width dimension allows for flexible placement on circuit boards without occupying excessive space.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency provides fast processing speed and responsiveness for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow temperature time ensures proper soldering and connection reliability during the assembly process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product's durability and stability during the soldering process.

Length: 20 mm

The moderate length dimension allows for versatile placement and integration within electronic devices without taking up excessive space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of microprocessor circuit peripherals enhances the product's capabilities and functionality for diverse application needs.

RAM Bytes: 16384

The RAM capacity in bytes supports efficient data processing and temporary storage requirements for embedded applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity for energy-efficient and reliable operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure and robust connections for reliable signal transmission and durability.

Maximum Supply Current: 11.75 mA

The specified maximum supply current ensures efficient power utilization and operation within the defined current limits.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides stable and consistent power delivery for reliable performance and operation.

ROM Programmability: FLASH

The programmable ROM (Read-Only Memory) using flash technology allows for easy and flexible firmware updates and customization.

Bus Compatibility: I2C; SPI; UART

The compatibility with I2C, SPI, and UART communication interfaces enables versatile connectivity and data exchange with other devices.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for dense packing and compact layout on circuit boards, suitable for space-constrained designs.

Moisture Sensitivity Level (MSL): 3

The MSL level indicates the product's sensitivity to moisture during storage and assembly, guiding proper handling and storage procedures.

Speed: 25 rpm

The specified speed parameter may refer to a specific operation or functionality enabled by the product, enhancing its utility in certain applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6778IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6778IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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