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MSP430F6778AIPZ

Texas Instruments

MSP430F6778AIPZ by Texas Instruments

MSP430F6778AIPZ by Texas Instruments is a 16-bit microprocessor with 6-Ch 10-Bit ADC channels and 3 DMA channels. It operates at a max clock frequency of 0.032768 MHz, suitable for industrial applications requiring low power consumption and high performance. With various connectivity options like I2C, IRDA, SPI, and UART, it offers versatile interfacing capabilities.

Median Price

$12.072

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,530 parts In-Stock

1+ parts

$12.072

100+ parts

$10.544

1k+ parts

$7.272

10k+ parts

-

2,530

$12.072

$10.544

$7.272

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,746 parts In-Stock

1+ parts

$11.468

100+ parts

-

1k+ parts

-

10k+ parts

-

2,746

$11.468

-

-

-

Vyrian

USA . 4,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,277

-

-

-

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Chip Stock

USA . 567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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567

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,804 parts In-Stock

1+ parts

$10.865

100+ parts

-

1k+ parts

-

10k+ parts

-

4,804

$10.865

-

-

-

AZTECH Wire

Italy . 333 parts In-Stock

1+ parts

$15.080

100+ parts

-

1k+ parts

-

10k+ parts

-

333

$15.080

-

-

-

Microchip USA

USA . 2,933 parts In-Stock

1+ parts

$33.520

100+ parts

$33.040

1k+ parts

$32.800

10k+ parts

$32.560

2,933

$33.520

$33.040

$32.800

$32.560

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$44.322

100+ parts

$40.333

1k+ parts

$36.344

10k+ parts

-

2,000

$44.322

$40.333

$36.344

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Corohmni

South Africa . 118 parts In-Stock

1+ parts

$50.282

100+ parts

-

1k+ parts

-

10k+ parts

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118

$50.282

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-

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Parana Technologies

USA . 1,265 parts In-Stock

1+ parts

$54.365

100+ parts

-

1k+ parts

-

10k+ parts

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1,265

$54.365

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-

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ChromeModa Solutions

Germany . 1,481 parts In-Stock

1+ parts

$61.084

100+ parts

$50.089

1k+ parts

-

10k+ parts

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1,481

$61.084

$50.089

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-

IDEA Electronic Components Group

UK . 1,026 parts In-Stock

1+ parts

$61.084

100+ parts

$58.030

1k+ parts

$54.976

10k+ parts

-

1,026

$61.084

$58.030

$54.976

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DigiPath Technology Company

USA . 581 parts In-Stock

1+ parts

-

100+ parts

$55.073

1k+ parts

-

10k+ parts

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581

-

$55.073

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Overview

Experience superior performance and reliability with the MSP430F6778AIPZ by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers cutting-edge technology that exceeds industry standards. This versatile microprocessor circuit is perfect for a wide range of applications, offering customers unparalleled value and benefits. With features like multiple ADC channels, PWM channels, and connectivity options, this product provides unmatched flexibility and efficiency. Trust Texas Instruments to provide you with the quality and innovation you need to stay ahead in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the product.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring optimal performance.

Bit Size: 16

Higher bit size allows for more complex operations and calculations, enhancing the product's capabilities.

ADC Channels: YES

Presence of Analog-to-Digital Convertor channels enables accurate conversion of analog signals to digital data for processing.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce the workload on the CPU.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program data, enhancing the product's functionality.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as a peripheral IC provides additional processing power and capabilities to the product.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options enable seamless integration with other devices and systems, expanding the product's usability.

Speed: 25 rpm

Operates at a high speed of 25 rpm, ensuring efficient performance in processing and executing tasks.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6778AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6778AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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