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MSP430F67781IPZ

Texas Instruments

MSP430F67781IPZ by Texas Instruments

MSP430F67781IPZ by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it supports I2C, SPI, UART buses for industrial applications requiring low power consumption. The package style is flatpack with a max seated height of 1.6 mm.

Median Price

$8.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,728 parts In-Stock

1+ parts

$10.260

100+ parts

$8.962

1k+ parts

$6.181

10k+ parts

-

1,728

$10.260

$8.962

$6.181

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Rochester

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$7.720

1k+ parts

$6.910

10k+ parts

$6.500

25

-

$7.720

$6.910

$6.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,200 parts In-Stock

1+ parts

$8.151

100+ parts

-

1k+ parts

-

10k+ parts

-

3,200

$8.151

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-

-

Vyrian

USA . 3,225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,225

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,839 parts In-Stock

1+ parts

$7.722

100+ parts

-

1k+ parts

-

10k+ parts

-

1,839

$7.722

-

-

-

Corohmni

South Africa . 886 parts In-Stock

1+ parts

$10.748

100+ parts

-

1k+ parts

-

10k+ parts

-

886

$10.748

-

-

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AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$20.710

100+ parts

-

1k+ parts

-

10k+ parts

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404

$20.710

-

-

-

Parana Technologies

USA . 1,768 parts In-Stock

1+ parts

$25.948

100+ parts

-

1k+ parts

$26.544

10k+ parts

-

1,768

$25.948

-

$26.544

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Microchip USA

USA . 2,657 parts In-Stock

1+ parts

$28.490

100+ parts

$28.090

1k+ parts

$27.880

10k+ parts

$27.680

2,657

$28.490

$28.090

$27.880

$27.680

DigiPath Technology Company

USA . 766 parts In-Stock

1+ parts

$28.572

100+ parts

-

1k+ parts

-

10k+ parts

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766

$28.572

-

-

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ChromeModa Solutions

Germany . 6,771 parts In-Stock

1+ parts

$29.155

100+ parts

$23.907

1k+ parts

-

10k+ parts

-

6,771

$29.155

$23.907

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IDEA Electronic Components Group

UK . 1,353 parts In-Stock

1+ parts

$29.155

100+ parts

$27.697

1k+ parts

$26.240

10k+ parts

-

1,353

$29.155

$27.697

$26.240

-

Overview

Unlock the full potential of your electronic designs with the MSP430F67781IPZ from Texas Instruments. This cutting-edge microprocessor circuit offers unmatched quality and reliability, thanks to its advanced CMOS technology and industrial-grade temperature rating. Whether you're working on IoT devices, consumer electronics, or industrial applications, this versatile IC provides seamless integration with I2C, SPI, and UART buses. Experience the power of 16-bit processing, efficient power management, and a wide range of ADC channels, all in a compact, low-profile package. Trust Texas Instruments to deliver exceptional performance and value for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and secure integration onto PCBs, saving space and improving overall reliability.

Maximum Supply Voltage: 3.6 V

Support for a high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in design.

Package Shape: SQUARE

Square package shape facilitates efficient PCB layout and integration, optimizing space usage.

CPU Family: MSP430

Utilizing the MSP430 CPU family offers high performance and low power consumption, making it ideal for battery-powered applications.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, enhancing the versatility and functionality of the IC.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving overall efficiency and reliability of the IC.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67781IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67781IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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