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MSP430F67781AIPZR

Texas Instruments

MSP430F67781AIPZR by Texas Instruments

MSP430F67781AIPZR by Texas Instruments features 16-bit CPU, 524288 ROM words, and 6-Ch 10-Bit ADC channels. Ideal for industrial applications requiring low power consumption and high performance with peripherals like BOR, RTC, and DMA. Operates in temperature range of -40 to 85 °C with a max clock frequency of 0.032768 MHz.

Median Price

$9.054

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$9.054

100+ parts

$7.908

1k+ parts

$5.454

10k+ parts

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950

$9.054

$7.908

$5.454

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,029 parts In-Stock

1+ parts

$8.601

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-

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1,029

$8.601

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Vyrian

USA . 7,940 parts In-Stock

1+ parts

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7,940

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Distributors (Availability)

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Corphita

USA . 1,269 parts In-Stock

1+ parts

$8.149

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-

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1,269

$8.149

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AZTECH Wire

Italy . 493 parts In-Stock

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$10.760

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493

$10.760

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Corohmni

South Africa . 385 parts In-Stock

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$22.257

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385

$22.257

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Microchip USA

USA . 2,236 parts In-Stock

1+ parts

$23.760

100+ parts

$23.420

1k+ parts

$23.250

10k+ parts

$23.080

2,236

$23.760

$23.420

$23.250

$23.080

Parana Technologies

USA . 423 parts In-Stock

1+ parts

$67.612

100+ parts

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423

$67.612

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DigiPath Technology Company

USA . 1,266 parts In-Stock

1+ parts

$74.450

100+ parts

$68.494

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1,266

$74.450

$68.494

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ChromeModa Solutions

Germany . 2,078 parts In-Stock

1+ parts

$75.969

100+ parts

$62.295

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2,078

$75.969

$62.295

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IDEA Electronic Components Group

UK . 1,008 parts In-Stock

1+ parts

$75.969

100+ parts

$72.171

1k+ parts

$68.372

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1,008

$75.969

$72.171

$68.372

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Overview

Experience the power of innovation with the MSP430F67781AIPZR by Texas Instruments. As a leader in cutting-edge technology, Texas Instruments has once again raised the bar with this versatile microprocessor circuit. Ideal for a wide range of applications, this product offers customers unparalleled value and benefits. With features like multiple ADC channels, DMA channels, and PWM channels, along with robust connectivity options, the MSP430F67781AIPZR delivers exceptional performance and reliability. Trust Texas Instruments to provide you with the quality and precision you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatility in power supply options, making the product compatible with a wide range of systems.

Bit Size: 16

With a 16-bit size, this product offers enhanced processing capabilities and can handle complex tasks efficiently.

ADC Channels: YES

Having Analog to Digital Convertor channels allows for accurate and efficient conversion of analog signals to digital data, expanding the product's functionality.

ROM Words: 524288

With a large ROM capacity of 524288 words, this product can store a significant amount of program data, enabling it to support a wide range of applications.

Technology: CMOS

Utilizing CMOS technology ensures efficient power consumption and high-speed operation, making the product energy-efficient and reliable.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities, allowing for advanced functionality and performance.

PWM Channels: YES

Having Pulse Width Modulation channels allows for precise control of digital signals, making the product suitable for applications that require accurate signal modulation.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Support for multiple connectivity options such as I2C, IRDA, SPI, and UART ensures compatibility with various communication protocols, making the product versatile and easy to integrate into different systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67781AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67781AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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