Loading...

MSP430F6777IPEUR

Texas Instruments

MSP430F6777IPEUR by Texas Instruments

MSP430F6777IPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. Operating at a max frequency of 25 MHz, it has ADC channels, operates b/w -40 to 85°C, and uses I2C, SPI, UART buses. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$9.445

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,509 parts In-Stock

1+ parts

$7.590

100+ parts

$6.188

1k+ parts

$4.125

10k+ parts

-

2,509

$7.590

$6.188

$4.125

-

Mouser Electronics

USA . 750 parts In-Stock

1+ parts

$11.300

100+ parts

$9.600

1k+ parts

$7.080

10k+ parts

-

750

$11.300

$9.600

$7.080

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,404 parts In-Stock

1+ parts

$7.210

100+ parts

-

1k+ parts

-

10k+ parts

-

3,404

$7.210

-

-

-

Vyrian

USA . 8,706 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,706

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,650 parts In-Stock

1+ parts

$6.831

100+ parts

-

1k+ parts

-

10k+ parts

-

4,650

$6.831

-

-

-

Corohmni

South Africa . 1,051 parts In-Stock

1+ parts

$8.524

100+ parts

-

1k+ parts

-

10k+ parts

-

1,051

$8.524

-

-

-

Microchip USA

USA . 2,823 parts In-Stock

1+ parts

$20.885

100+ parts

-

1k+ parts

-

10k+ parts

-

2,823

$20.885

-

-

-

Parana Technologies

USA . 301 parts In-Stock

1+ parts

$33.688

100+ parts

$3,128.468

1k+ parts

$30.319

10k+ parts

-

301

$33.688

$3,128.468

$30.319

-

DigiPath Technology Company

USA . 3 parts In-Stock

1+ parts

$37.095

100+ parts

$34.127

1k+ parts

-

10k+ parts

-

3

$37.095

$34.127

-

-

ChromeModa Solutions

Germany . 5,568 parts In-Stock

1+ parts

$37.852

100+ parts

$31.039

1k+ parts

-

10k+ parts

-

5,568

$37.852

$31.039

-

-

IDEA Electronic Components Group

UK . 876 parts In-Stock

1+ parts

$37.852

100+ parts

$35.959

1k+ parts

$34.067

10k+ parts

-

876

$37.852

$35.959

$34.067

-

Overview

Experience unparalleled performance and reliability with the Texas Instruments MSP430F6777IPEUR. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. This versatile microprocessor circuit offers a wide range of applications, making it an essential component for your projects. With its advanced features and innovative technology, the MSP430F6777IPEUR provides unmatched value, benefits, and advantages to customers looking for a high-performance solution. Upgrade your systems today with this exceptional product and unleash the full potential of your designs. Elevate your work with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and resistance to heat and chemicals, making the product reliable in various environments.

Surface Mount: YES

Surface mount technology allows for a compact design, saving space on the PCB and enabling high-density layouts.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6 V provides flexibility in power supply options while ensuring reliable performance.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and integrate into the PCB layout efficiently.

Bit Size: 16

Having a bit size of 16 allows for complex computations and data processing capabilities, suitable for diverse applications.

Power Supplies (V): 2/3.3

Supporting multiple power supply options of 2V and 3.3V increases compatibility with different power sources and systems.

No. of Terminals: 128

Having 128 terminals provides sufficient connectivity options for interfacing with other components and peripherals.

Minimum Supply Voltage: 1.8 V

Operating at a minimum supply voltage of 1.8 V allows for energy-efficient performance without compromising functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperatures in industrial applications.

CPU Family: MSP430

Belonging to the MSP430 CPU family indicates high performance, low power consumption, and advanced features for enhanced functionality.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures reliable performance even in cold environments or during temperature fluctuations.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6777IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6777IPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20