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MSP430F6777IPEU

Texas Instruments

MSP430F6777IPEU by Texas Instruments

MSP430F6777IPEU by Texas Instruments is a 16-bit MCU with 262144 ROM words, 32 RAM words, and 25 MHz clock frequency. Ideal for industrial applications, it operates b/w -40 to 85 °C with a supply voltage range of 1.8-3.6 V. Features include ADC channels, I2C/SPI/UART compatibility, and low power consumption at 11.75 mA max current draw.

Median Price

$9.925

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,898 parts In-Stock

1+ parts

$9.925

100+ parts

$8.091

1k+ parts

$5.394

10k+ parts

-

1,898

$9.925

$8.091

$5.394

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,377 parts In-Stock

1+ parts

$9.429

100+ parts

-

1k+ parts

-

10k+ parts

-

1,377

$9.429

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-

-

Vyrian

USA . 2,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,735

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,022 parts In-Stock

1+ parts

$8.932

100+ parts

-

1k+ parts

-

10k+ parts

-

2,022

$8.932

-

-

-

Corohmni

South Africa . 742 parts In-Stock

1+ parts

$10.302

100+ parts

-

1k+ parts

-

10k+ parts

-

742

$10.302

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-

-

AZTECH Wire

Italy . 1,075 parts In-Stock

1+ parts

$11.550

100+ parts

-

1k+ parts

-

10k+ parts

-

1,075

$11.550

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-

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Ampacity Inc.

Singapore . 1,424 parts In-Stock

1+ parts

$18.360

100+ parts

-

1k+ parts

-

10k+ parts

-

1,424

$18.360

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-

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Parana Technologies

USA . 1,345 parts In-Stock

1+ parts

$67.686

100+ parts

$6,285.698

1k+ parts

$60.918

10k+ parts

-

1,345

$67.686

$6,285.698

$60.918

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DigiPath Technology Company

USA . 281 parts In-Stock

1+ parts

$74.531

100+ parts

-

1k+ parts

-

10k+ parts

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281

$74.531

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-

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ChromeModa Solutions

Germany . 1,068 parts In-Stock

1+ parts

$76.052

100+ parts

$62.363

1k+ parts

-

10k+ parts

-

1,068

$76.052

$62.363

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IDEA Electronic Components Group

UK . 621 parts In-Stock

1+ parts

$76.052

100+ parts

$72.249

1k+ parts

$68.447

10k+ parts

-

621

$76.052

$72.249

$68.447

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Overview

Discover the Texas Instruments MSP430F6777IPEU, a top-of-the-line microprocessor circuit designed to meet all your application needs. With a reputation for excellence, Texas Instruments delivers unparalleled quality and innovation in the field of Other Function uPs,uCs & Peripheral ICs. This powerful device offers 16-bit processing capabilities, seamless integration with I2C, SPI, and UART buses, and a robust flash ROM for easy programmability. Whether you're working on industrial automation, sensor interfacing, or IoT applications, the MSP430F6777IPEU provides unmatched performance and reliability. Upgrade your projects today with Texas Instruments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and resistance to heat, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit designs, making the product suitable for small electronic devices.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power supply inputs, increasing its versatility.

Bit Size: 16

A larger bit size allows for higher computational capabilities, making the product suitable for tasks that require complex calculations.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages offers flexibility in powering the device, ensuring compatibility with different environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6777IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6777IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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