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MSP430F67771AIPZ

Texas Instruments

MSP430F67771AIPZ by Texas Instruments

MSP430F67771AIPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.955

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,230 parts In-Stock

1+ parts

$8.955

100+ parts

$7.301

1k+ parts

$4.867

10k+ parts

-

2,230

$8.955

$7.301

$4.867

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 438 parts In-Stock

1+ parts

$8.507

100+ parts

-

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438

$8.507

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Chip Stock

USA . 7,020 parts In-Stock

1+ parts

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7,020

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Vyrian

USA . 5,456 parts In-Stock

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5,456

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,349 parts In-Stock

1+ parts

$8.060

100+ parts

-

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1,349

$8.060

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AZTECH Wire

Italy . 92 parts In-Stock

1+ parts

$13.020

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92

$13.020

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$45.149

100+ parts

$44.698

1k+ parts

$42.892

10k+ parts

-

50

$45.149

$44.698

$42.892

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Parana Technologies

USA . 1,843 parts In-Stock

1+ parts

$62.198

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1,843

$62.198

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DigiPath Technology Company

USA . 202 parts In-Stock

1+ parts

$68.487

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202

$68.487

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IDEA Electronic Components Group

UK . 2,375 parts In-Stock

1+ parts

$69.885

100+ parts

$66.391

1k+ parts

$62.896

10k+ parts

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2,375

$69.885

$66.391

$62.896

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ChromeModa Solutions

Germany . 1,735 parts In-Stock

1+ parts

$69.885

100+ parts

$57.306

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1,735

$69.885

$57.306

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Corohmni

South Africa . 2,929 parts In-Stock

1+ parts

$75.277

100+ parts

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2,929

$75.277

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Overview

Unlock the endless possibilities of the MSP430F67771AIPZ by Texas Instruments, a cutting-edge microprocessor circuit that seamlessly integrates into a variety of applications. With a wide range of peripherals including BOR, RTC, and multiple timers, this industrial-grade IC offers unmatched performance and reliability. From smart home devices to automotive systems, this versatile chip delivers superior functionality with its 32KB RAM and 262144 ROM words. Trust in Texas Instruments' reputation for excellence and elevate your product to new heights with the MSP430F67771AIPZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the product.

Maximum Supply Voltage: 3.6 V

Allows for a higher power input, making the product suitable for a wide range of applications.

Bit Size: 16

Offers a high level of computational power and processing capabilities.

ADC Channels: YES

Allows for analog to digital conversion, enabling the product to interface with various sensors and external devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Provides additional functions to the main processor, enhancing the overall performance and capabilities of the product.

Temperature Grade: INDUSTRIAL

Designed to operate in harsh industrial environments, ensuring reliability and performance under tough conditions.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Offers multiple communication options for interfacing with other devices, increasing the product's versatility and compatibility.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67771AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67771AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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